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Dane Sievers
Dane Sievers
Verified email at illinois.edu
Title
Cited by
Cited by
Year
Three-dimensional radio-frequency transformers based on a self-rolled-up membrane platform
W Huang, J Zhou, PJ Froeter, K Walsh, S Liu, MD Kraman, M Li, ...
Nature Electronics 1 (5), 305-313, 2018
802018
Control of the Interface Between Electron‐Hole and Electron‐Ion Plasmas: Hybrid Semiconductor‐Gas Phase Devices as a Gateway for Plasma Science
PA Tchertchian, CJ Wagner, TJ Houlahan Jr, B Li, DJ Sievers, JG Eden
Contributions to Plasma Physics 51 (10), 889-905, 2011
412011
Monolithic mtesla-level magnetic induction by self-rolled-up membrane technology
W Huang, Z Yang, MD Kraman, Q Wang, Z Ou, MM Rojo, AS Yalamarthy, ...
Science advances 6 (3), eaay4508, 2020
402020
Producing silicon carbide micro and nanostructures by plasma‐free metal‐assisted chemical etching
JA Michaels, L Janavicius, X Wu, C Chan, HC Huang, S Namiki, M Kim, ...
Advanced Functional Materials 31 (32), 2103298, 2021
282021
Monolithic radio frequency SiNx self-rolled-up nanomembrane interdigital capacitor modeling and fabrication
L Sang, H Zhou, Z Yang, MD Kraman, H Zhao, JA Michaels, DJ Sievers, ...
Nanotechnology 30 (36), 364001, 2019
182019
Flexible hybrid plasma-semiconductor transistors and arrays
JG Eden, PA Tchertchian, TJ Houlahan, DJ Sievers, B Li, CJ Wagner
US Patent 8,816,435, 2014
172014
Photolithography in the vacuum ultraviolet (172 nm) with sub-400 nm resolution: photoablative patterning of nanostructures and optical components in bulk polymers and thin …
AE Mironov, J Kim, Y Huang, AW Steinforth, DJ Sievers, JG Eden
Nanoscale 12 (32), 16796-16804, 2020
162020
Programmable vapor-phase metal-assisted chemical etching for versatile high-aspect ratio silicon nanomanufacturing
LL Janavicius, JA Michaels, C Chan, DJ Sievers, X Li
Applied Physics Reviews 10 (1), 2023
112023
Commercialization of microcavity plasma devices and arrays: Systems for VUV photolithography and nanopatterning, disinfection of drinking water and air, and biofilm …
J Kim, AE Mironov, JH Cho, DS Sievers, CM Herring, S Park, PP Sun, ...
Plasma Processes and Polymers 19 (10), 2200075, 2022
72022
Effect of Perforation on the Thermal and Electrical Breakdown of Self‐Rolled‐Up Nanomembrane Structures
JA Michaels, DR Wood, PJ Froeter, W Huang, DJ Sievers, X Li
Advanced Materials Interfaces 6 (21), 1901022, 2019
72019
Photoablative lithography of cellulose acetate at 172 nm: Subtractive 3D printing of biodegradable optical microstructures and molds for polydimethylsiloxane patterning
AE Mironov, S Park, J Kim, DJ Sievers, SJ Park, S Spirk, JG Eden
APL Materials 9 (11), 2021
52021
Plasma‐Damage Free Efficiency Scaling of Micro‐LEDs by Metal‐Assisted Chemical Etching
CY Chan, HC Roberts, Y Xiao, PJ Froeter, DJ Sievers, Z Mi, X Li
Advanced Optical Materials, 2302957, 2024
12024
Eco-friendly 3D micromachining of polymers by 172 nm photoablation for optical and microfluidics applications
AE Mironov, S Park, T Reboli, J Kim, DJ Sievers, SJ Park, JG Eden
UV and Higher Energy Photonics: From Materials to Applications 2021 11801 …, 2021
12021
Arrays of microplasma-assisted atomic layer deposition and etching free patterning of Ga2O3 thin film with flexible DUV photodetector
J Kim, AE Mironov, DJ Sievers, S Park, JG Eden
CLEO: Applications and Technology, JTu3A. 86, 2021
12021
Flexible and on wafer hybrid plasma-semiconductor transistors
JG Eden, PA Tchertchian, CJ Wagner, DJ Sievers, TJ Houlahan, B Li
US Patent 9,184,341, 2015
12015
Uniform broad-area deposition and patterning of SiO2 nanofilms by 172 nm photochemical conversion of liquid tetraethoxysilane layers at 300 K
J Kim, DJ Sievers, AE Mironov, SJ Park, JG Eden
APL Materials 12 (1), 2024
2024
Publisher's Note:“Programmable vapor-phase metal-assisted chemical etching for versatile high-aspect ratio silicon nanomanufacturing”[Appl. Phys. Rev. 10, 011409 (2023)]
LL Janavicius, JA Michaels, C Chan, DJ Sievers, X Li
Applied Physics Reviews 10 (2), 029901, 2023
2023
Photoresist-free deposition and patterning with vacuum ultraviolet lamps
JG Eden, A Mironov, DJ Sievers
US Patent App. 17/612,830, 2022
2022
Methods and systems for large area and low defect monolayer ordering of microspheres and nanospheres
D Sievers, S Grewal, L Janavicius, J Michaels
US Patent App. 17/558,996, 2022
2022
Photoresist-free photolithography, photoprocessing tools, and methods with vuv or deep-uv lamps
JG Eden, D Sievers, A Mironov, J Kim
US Patent App. 17/268,276, 2021
2021
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