Willem Dirk van Driel
Willem Dirk van Driel
Associate Professor Delft University of Technology
Verified email at philips.com
Title
Cited by
Cited by
Year
Mechanics of microelectronics
GQ Zhang, WD Van Driel, XJ Fan
Springer Science & Business Media, 2006
2142006
Design approach to sealant selection for the life of the well
M Bosma, K Ravi, W Van Driel, GJ Schreppers
SPE annual technical conference and exhibition, 1999
2091999
A biomechanical regulatory model for periprosthetic fibrous-tissue differentiation
R Huiskes, WD van Driel, PJ Prendergast, K Søballe
Journal of materials science: Materials in medicine 8 (12), 785-788, 1997
2071997
Solid state lighting reliability: components to systems
WD Van Driel, XJ Fan
Springer Science & Business Media, 2012
1502012
Time-dependent mechanical behaviour of the periodontal ligament
WD Van Driel, EJ Van Leeuwen, JW Von den Hoff, JC Maltha, ...
Proceedings of the Institution of Mechanical Engineers, Part H: Journal of …, 2000
1172000
Interfacial delamination mechanisms during soldering reflow with moisture preconditioning
X Fan, GQ Zhang, WD Van Driel, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008
962008
Stress–strain characteristics of tin-based solder alloys for drop-impact modeling
EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ...
Journal of Electronic Materials 37 (6), 829-836, 2008
852008
Advances in the drop-impact reliability of solder joints for mobile applications
EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai
Microelectronics Reliability 49 (2), 139-149, 2009
732009
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang
Optical Materials 35 (3), 504-508, 2013
702013
A comparison of finite element codes for the solution of biphasic poroelastic problems
PJ Prendergast, WD Van Driel, JH Kuiper
Proceedings of the Institution of Mechanical engineers, Part H: Journal of …, 1996
681996
Driving mechanisms of delamination related reliability problems in exposed pad packages
WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008
642008
Prediction and verification of process induced warpage of electronic packages
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi
Microelectronics Reliability 43 (5), 765-774, 2003
622003
Semiconductor device
JJ Dimasacat, JL Tan, WD Van Driel
US Patent 7,838,973, 2010
572010
Packaging induced die stresses—Effect of chip anisotropy and time-dependent behavior of a molding compound
WD Van Driel, JHJ Janssen, GQ Zhang, DG Yang, LJ Ernst
J. Electron. Packag. 125 (4), 520-526, 2003
572003
Response surface modeling for nonlinear packaging stresses
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst
J. Electron. Packag. 125 (4), 490-497, 2003
562003
Why does intermittent hydrostatic pressure enhance the mineralization process in fetal cartilage?
E Tanck, WD Van Driel, JW Hagen, EH Burger, L Blankevoort, R Huiskes
Journal of biomechanics 32 (2), 153-161, 1999
561999
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP
F Sun, P Hochstenbach, WD Van Driel, GQ Zhang
Microelectronics Reliability 48 (8-9), 1167-1170, 2008
512008
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang
Microelectronics Reliability 54 (1), 138-142, 2014
502014
Prediction of delamination related IC & packaging reliability problems
WD Van Driel, MAJ Van Gils, RBR van Silfhout, GQ Zhang
Microelectronics Reliability 45 (9-11), 1633-1638, 2005
502005
Creep fatigue models of solder joints: A critical review
EH Wong, WD Van Driel, A Dasgupta, M Pecht
Microelectronics Reliability 59, 1-12, 2016
492016
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