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Year
Plasma processing of low-k dielectrics
MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ...
Journal of Applied Physics 113 (4), 2013
3512013
Plasma processing of low-k dielectrics
MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ...
Journal of Applied Physics 113 (4), 2013
3512013
Mechanistic study of plasma damage of low k dielectric surfaces
J Bao, H Shi, J Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ...
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2008
1172008
Mechanistic study of plasma damage of low k dielectric surfaces
J Bao, H Shi, J Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ...
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2008
1162008
Role of ions, photons, and radicals in inducing plasma damage to ultra low-k dielectrics
H Shi, H Huang, J Bao, J Liu, PS Ho, Y Zhou, JT Pender, MD Armacost, ...
Journal of Vacuum Science & Technology B 30 (1), 2012
612012
Origin of dielectric loss induced by oxygen plasma on organo-silicate glass low-k dielectrics
H Shi, J Bao, RS Smith, H Huang, J Liu, PS Ho, ML McSwiney, ...
Applied Physics Letters 93 (19), 2008
382008
Restoration and pore sealing of plasma damaged porous organosilicate low dielectrics with phenyl containing agents
J Liu, W Kim, J Bao, H Shi, W Baek, PS Ho
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2007
312007
Oxygen plasma damage to blanket and patterned ultralow-κ surfaces
J Bao, H Shi, H Huang, PS Ho, ML McSwiney, MD Goodner, M Moinpour, ...
Journal of Vacuum Science & Technology A 28 (2), 207-215, 2010
302010
O2 plasma damage and dielectric recoveries to patterned CDO low-k dielectrics
H Huang, J Bao, H Shi, PS Ho, ML McSwiney, MD Goodner, M Moinpour, ...
Advanced Metallization Conference, 2008
262008
Mechanistic study of plasma damage and CH4 recovery of low k dielectric surface
JJ Bao, HL Shi, JJ Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ...
2007 IEEE International Interconnect Technology Conferencee, 147-149, 2007
192007
Mechanistic study of plasma damage to porous low-k: process development and dielectric recovery
H Shi
The University of Texas at Austin, 2010
142010
Plasma altered layer model for plasma damage characterization of porous OSG films
H Shi, H Huang, J Bao, J Im, PS Ho, Y Zhou, JT Pender, M Armacost, ...
2009 IEEE International Interconnect Technology Conference, 78-80, 2009
102009
Moisture transport and its effects on fracture strength and dielectric constant of underfill materials
KH Lu, B Chao, Z Luo, L Zhang, H Shi, J Im, PS Ho, L Li, M Ahmad
2007 Proceedings 57th Electronic Components and Technology Conference, 1040-1044, 2007
102007
Plasma Processing of Low‐k Dielectrics
H Shi, D Shamiryan, JF de Marneffe, H Huang, PS Ho, MR Baklanov
Advanced Interconnects for ULSI Technology, 79-128, 2012
82012
Advanced Interconnects for ULSI Technology
H Shi, D Shamiryan, JF de Marneffe, H Huang, PS Ho, MR Baklanov
Wiley, 2012
72012
Moinpour M and Kloster GM
J Bao, H Shi, H Huang, PS Ho, ML McSwiney, MD Goodner
J. Vac. Sci. Technol. A 2010, 28, 2010
62010
Dielectric recoveries on O2 plasma damaged organosilicate low-k dielectrics
HL Shi, JJ Bao, JJ Liu, H Huang, RS Smith, Q Zha, PS Ho, MD Goodner, ...
Proceedings of the Advanced Metallization Conference 23, 447, 2007
62007
Minimization of plasma ashing damage to OSG low-k dielectrics
H Shi, H Huang, J Im, PS Ho, Y Zhou, JT Pender, M Armacost, D Kyser
2010 IEEE International Interconnect Technology Conference, 1-3, 2010
52010
Effect of CH 4 Plasma Treatment on O 2 Plasma Ashed Organosilicate Low-k Dielectrics
H Shi, J Bao, J Liu, H Huang, PS Ho, MD Goodner, M Moinpour, ...
Materials, Processes, Integration and Reliability in Advanced Interconnect …, 2007
52007
Huang H and Ho PS
MR Baklanov, JF de Marneffe, D Shamiryan, AM Urbanowicz, H Shi, ...
J. Appl. Phys. 2013, 113, 2013
42013
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