| Flexible and stretchable electronics for wearable health devices J Van Den Brand, M de Kok, M Koetse, M Cauwe, R Verplancke, ... Solid-State Electronics 113, 116-120, 2015 | 104 | 2015 |
| A novel 60 GHz wideband coupled half-mode/quarter-mode substrate integrated waveguide antenna T Deckmyn, S Agneessens, ACF Reniers, AB Smolders, M Cauwe, ... IEEE Transactions on Antennas and Propagation 65 (12), 6915-6926, 2017 | 52 | 2017 |
| Broadband material parameter characterization for practical high-speed interconnects on printed circuit board M Cauwe, J De Baets IEEE transactions on advanced packaging 31 (3), 649-656, 2008 | 45 | 2008 |
| Dual-band (28, 38) GHz coupled quarter-mode substrate-integrated waveguide antenna array for next-generation wireless systems T Deckmyn, M Cauwe, DV Ginste, H Rogier, S Agneessens IEEE Transactions on Antennas and Propagation 67 (4), 2405-2412, 2019 | 37 | 2019 |
| Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending DA Van Den Ende, HJ Van De Wiel, RHL Kusters, A Sridhar, JFM Schram, ... Microelectronics Reliability 54 (12), 2860-2870, 2014 | 32 | 2014 |
| Industrial and technical aspects of chip embedding technology A Ostmann, D Manessis, J Stahr, M Beesley, M Cauwe, J De Baets 2008 2nd Electronics System-Integration Technology Conference, 315-320, 2008 | 32 | 2008 |
| Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide L Wang, T Sterken, M Cauwe, D Cuypers, J Vanfleteren IEEE Transactions on Components, Packaging and Manufacturing technology 2 (7 …, 2012 | 29 | 2012 |
| Novel interconnect methodologies for ultra-thin chips on foils A Sridhar, M Cauwe, H Fledderus, RHL Kusters, J Van Den Brand 2012 IEEE 62nd Electronic Components and Technology Conference, 238-244, 2012 | 22 | 2012 |
| Flexible and stretchable electronics for wearable healthcare J van den Brand, M de Kok, A Sridhar, M Cauwe, R Verplancke, F Bossuyt, ... 2014 44th European Solid State Device Research Conference (ESSDERC), 206-209, 2014 | 17 | 2014 |
| Large area flexible lighting foils using distributed bare LED dies on polyester substrates DA Van den Ende, RHL Kusters, M Cauwe, A Van Der Waal, ... Microelectronics Reliability 53 (12), 1907-1915, 2013 | 16 | 2013 |
| Sensitivity analysis of broadband on-wafer dielectric spectroscopy of yeast cell suspensions up to 110 GHz S Liu, I Ocket, M Cauwe, D Schreurs, B Nauwelaers IEEE Microwave and Wireless Components Letters 25 (3), 199-201, 2015 | 15 | 2015 |
| Flipchip bonding of thin Si dies onto PET foils: possibilities and applications J van den Brand, R Kusters, M Cauwe, D van den Ende, M Erinc 18th European Microelectronics & Packaging Conference, 1-6, 2011 | 15 | 2011 |
| Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ... 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 14 | 2017 |
| Polyimide-ALD-polyimide layers as hermetic encapsulant for implants D Schaubroeck, R Verplancke, M Cauwe, D Cuypers, K Baumans, ... XXXI International Conference on Surface Modification Technologies (SMT31), 1-6, 2017 | 14 | 2017 |
| High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages S Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J Vanfleteren IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013 | 14 | 2013 |
| Intraneural active probe for bidirectional peripheral nerve interface M Ballini, J Bae, N Marrocco, R Verplancke, D Schaubroeck, D Cuypers, ... 2017 Symposium on VLSI Circuits, C50-C51, 2017 | 13 | 2017 |
| Laser ablation as an enabling technology for opto-boards P Van Daele, P Geerinck, G Van Steenberge, S Van Put, M Cauwe 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 13 | 2003 |
| High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies D van den Ende, F Verhoeven, P van der Eijnden, R Kusters, A Sridhar, ... 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-6, 2013 | 10 | 2013 |
| Embedding active components as a 3D packaging solution M Cauwe, W Christiaens, J Vanfleteren, J De Baets Advancing Microelectronics 1, 15-19, 2006 | 10 | 2006 |
| A conformable active matrix LED display A Tripathi, E Smits, JL Van Der Steen, M Cauwe, R Verplancke, K Myny, ... International meeting on information displays, 2015 | 9 | 2015 |
Johan De Baetsimec, University Gent, CMSTVerified email at UGent.be
