Maarten Cauwe
Maarten Cauwe
imec/UGent - Cmst
Verified email at imec.be
Title
Cited by
Cited by
Year
Flexible and stretchable electronics for wearable health devices
J Van Den Brand, M de Kok, M Koetse, M Cauwe, R Verplancke, ...
Solid-State Electronics 113, 116-120, 2015
1042015
A novel 60 GHz wideband coupled half-mode/quarter-mode substrate integrated waveguide antenna
T Deckmyn, S Agneessens, ACF Reniers, AB Smolders, M Cauwe, ...
IEEE Transactions on Antennas and Propagation 65 (12), 6915-6926, 2017
522017
Broadband material parameter characterization for practical high-speed interconnects on printed circuit board
M Cauwe, J De Baets
IEEE transactions on advanced packaging 31 (3), 649-656, 2008
452008
Dual-band (28, 38) GHz coupled quarter-mode substrate-integrated waveguide antenna array for next-generation wireless systems
T Deckmyn, M Cauwe, DV Ginste, H Rogier, S Agneessens
IEEE Transactions on Antennas and Propagation 67 (4), 2405-2412, 2019
372019
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending
DA Van Den Ende, HJ Van De Wiel, RHL Kusters, A Sridhar, JFM Schram, ...
Microelectronics Reliability 54 (12), 2860-2870, 2014
322014
Industrial and technical aspects of chip embedding technology
A Ostmann, D Manessis, J Stahr, M Beesley, M Cauwe, J De Baets
2008 2nd Electronics System-Integration Technology Conference, 315-320, 2008
322008
Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide
L Wang, T Sterken, M Cauwe, D Cuypers, J Vanfleteren
IEEE Transactions on Components, Packaging and Manufacturing technology 2 (7 …, 2012
292012
Novel interconnect methodologies for ultra-thin chips on foils
A Sridhar, M Cauwe, H Fledderus, RHL Kusters, J Van Den Brand
2012 IEEE 62nd Electronic Components and Technology Conference, 238-244, 2012
222012
Flexible and stretchable electronics for wearable healthcare
J van den Brand, M de Kok, A Sridhar, M Cauwe, R Verplancke, F Bossuyt, ...
2014 44th European Solid State Device Research Conference (ESSDERC), 206-209, 2014
172014
Large area flexible lighting foils using distributed bare LED dies on polyester substrates
DA Van den Ende, RHL Kusters, M Cauwe, A Van Der Waal, ...
Microelectronics Reliability 53 (12), 1907-1915, 2013
162013
Sensitivity analysis of broadband on-wafer dielectric spectroscopy of yeast cell suspensions up to 110 GHz
S Liu, I Ocket, M Cauwe, D Schreurs, B Nauwelaers
IEEE Microwave and Wireless Components Letters 25 (3), 199-201, 2015
152015
Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
J van den Brand, R Kusters, M Cauwe, D van den Ende, M Erinc
18th European Microelectronics & Packaging Conference, 1-6, 2011
152011
Ultra-thin biocompatible implantable chip for bidirectional communication with peripheral nerves
MO de Beeck, R Verplancke, D Schaubroeck, D Cuypers, M Cauwe, ...
2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017
142017
Polyimide-ALD-polyimide layers as hermetic encapsulant for implants
D Schaubroeck, R Verplancke, M Cauwe, D Cuypers, K Baumans, ...
XXXI International Conference on Surface Modification Technologies (SMT31), 1-6, 2017
142017
High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages
S Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J Vanfleteren
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013
142013
Intraneural active probe for bidirectional peripheral nerve interface
M Ballini, J Bae, N Marrocco, R Verplancke, D Schaubroeck, D Cuypers, ...
2017 Symposium on VLSI Circuits, C50-C51, 2017
132017
Laser ablation as an enabling technology for opto-boards
P Van Daele, P Geerinck, G Van Steenberge, S Van Put, M Cauwe
53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003
132003
High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
D van den Ende, F Verhoeven, P van der Eijnden, R Kusters, A Sridhar, ...
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-6, 2013
102013
Embedding active components as a 3D packaging solution
M Cauwe, W Christiaens, J Vanfleteren, J De Baets
Advancing Microelectronics 1, 15-19, 2006
102006
A conformable active matrix LED display
A Tripathi, E Smits, JL Van Der Steen, M Cauwe, R Verplancke, K Myny, ...
International meeting on information displays, 2015
92015
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Articles 1–20