Bichen Chen
Bichen Chen
Facebook, Inc. Network Hardware Engineering Group
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Year
A novel de-embedding method suitable for transmission-line measurement
B Chen, X Ye, B Samaras, J Fan
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 1-4, 2015
332015
Analytical and numerical sensitivity analyses of fixtures de-embedding
B Chen, M Tsiklauri, C Wu, S Jin, J Fan, X Ye, B Samaras
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
312016
Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations
S Jin, X Fang, B Chen, H Gao, X Ye, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
262016
Characterization of PCB dielectric properties using two striplines on the same board
L Hua, B Chen, S Jin, M Koledintseva, J Lim, K Qiu, R Brooks, J Zhang, ...
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
262014
Improved “Root-Omega” method for transmission-line-based material property extraction for multilayer PCBs
S Jin, B Chen, X Fang, H Gao, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1356-1367, 2017
252017
Thru-reflect-line calibration technique: Error analysis for characteristic impedance variations in the line standards
L Ye, C Li, X Sun, S Jin, B Chen, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (3), 779-788, 2016
242016
Error bounds analysis of de-embedded results in 2x thru de-embedding methods
C Wu, B Chen, T Mikheil, J Fan, X Ye
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
232017
Accurate characterization of PCB transmission lines for high speed interconnect
X Ye, J Fan, B Chen, JL Drewniak, QB Chen
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 16-19, 2015
182015
Analytical equivalent circuit modeling for BGA in high-speed package
S Jin, D Liu, B Chen, R Brooks, K Qiu, J Lim, J Fan
IEEE Transactions on Electromagnetic Compatibility 60 (1), 68-76, 2017
172017
Dielectric dissipation factor (DF) extraction based on differential measurements and 2-D cross-sectional analysis
S Yong, Y Liu, H Gao, B Chen, S De, S Hinaga, D Yanagawa, J Drewniak, ...
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
162018
Integrated crosstalk noise (ICN) analysis among multiple differential BGA and via pairs by using design of experiments (DoE) method
B Chen, M Ouyang, S Yong, Y Wang, Y Bai, Y Zhou, J Fan
Electromagnetic Compatibility (EMC), 2017 IEEE International Symposium, 2017
142017
James
C Chen, B Chen, R Zai
Drewniak,“De-embedding Comparisons of 1X-Thru SFD, 2004
122004
Multi-Ports ([) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization
B Chen, J He, Y Guo, S Pan, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 61 (4), 1261-1270, 2019
112019
Differential S-parameter de-embedding for 8-port network
B Chen, J He, X Sun, Y Guo, S Jin, X Ye, J Fan
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
112018
De-embedding comparisons of 1X-Reflect SFD, 1-port AFR, and 2X-Thru SFD
Y Chen, B Chen, J He, R Zai, J Fan, J Drewniak
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 …, 2018
102018
Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and via pairs by using design of experiments (DoE) method
B Chen, M Ouyang, S Yong, Y Wang, J Wang, S Jin, Y Bai, Y Zhou, J Fan
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
92017
Differential integrated crosstalk noise (ICN) mitigation in the pin field area of SerDes channel
B Chen, J Wang, YS Cao, M Ouyang, Y Wang, S Jin, G Shen, X Liu, ...
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
82018
Parallel plate impedance and equivalent inductance extraction considering proximity effect by a modal approach
S Jin, D Liu, Y Wang, B Chen, J Fan
IEEE Transactions on Electromagnetic Compatibility 60 (5), 1481-1490, 2018
82018
Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer
Q Wang, K Shringarpure, B Chen, J Fan, C Hwang, S Pan, B Achkir
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014
82014
Thru-Line De-embedding (TLD), an Accurate and Simplified Fixture Removal Method with Self-validating Line Standard
JF Bichen Chen, Xiaoning Ye, Qiaolei Huang, Shuai Jin
DesignCon2017, 2017
72017
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