| Ontop: Answering SPARQL queries over relational databases D Calvanese, B Cogrel, S Komla-Ebri, R Kontchakov, D Lanti, M Rezk, ... Semantic Web 8 (3), 471-487, 2017 | 568 | 2017 |
| Air gap semiconductor structure with selective cap bilayer SM Gates, EE Huang, DR Kioussis, CJ Penny, D Priyadarshini US Patent 9,305,836, 2016 | 367 | 2016 |
| Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art A Grill, SM Gates, TE Ryan, SV Nguyen, D Priyadarshini Applied Physics Reviews 1 (1), 2014 | 293 | 2014 |
| Substrate bonding with diffusion barrier structures DC Edelstein, DC La Tulipe Jr, W Lin, D Priyadarshini, S Skordas, TA Vo, ... US Patent 9,620,481, 2017 | 121 | 2017 |
| Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect SM Gates, EE Huang, J Lee, SV Nguyen, BC Peethala, CJ Penny, ... US Patent 9,349,687, 2016 | 66 | 2016 |
| Substrate bonding with diffusion barrier structures DC Edelstein, DC La Tulipe Jr, W Lin, D Priyadarshini, S Skordas, TA Vo, ... US Patent 9,064,937, 2015 | 60 | 2015 |
| Tungsten and cobalt metallization: A material study for MOL local interconnects V Kamineni, M Raymond, S Siddiqui, F Mont, S Tsai, C Niu, A Labonte, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 57 | 2016 |
| High-Throughput Characterization of Surface Segregation in CuxPd1–x Alloys D Priyadarshini, P Kondratyuk, YN Picard, BD Morreale, AJ Gellman, ... The Journal of Physical Chemistry C 115 (20), 10155-10163, 2011 | 53 | 2011 |
| BEOL process integration for the 7 nm technology node T Standaert, G Beique, HC Chen, ST Chen, B Hamieh, J Lee, ... 2016 IEEE international interconnect technology conference/advanced …, 2016 | 37 | 2016 |
| Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology † P Batra, S Skordas, D LaTulipe, K Winstel, C Kothandaraman, B Himmel, ... Journal of Low Power Electronics and Applications 4 (2), 77-89, 2014 | 37 | 2014 |
| Interconnect structure with barrier layer DC Edelstein, SV Nguyen, T Nogami, D Priyadarshini, HK Shobha US Patent 9,601,371, 2017 | 34 | 2017 |
| Wafer-to-wafer oxide fusion bonding W Lin, D Priyadarshini, S Skordas, TA Vo US Patent 9,028,628, 2015 | 26 | 2015 |
| Interconnect structure with capping layer and barrier layer DC Edelstein, SV Nguyen, T Nogami, D Priyadarshini, HK Shobha US Patent 9,455,182, 2016 | 23 | 2016 |
| Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes T Nogami, BD Briggs, S Korkmaz, M Chae, C Penny, J Li, W Wang, ... 2015 IEEE International Electron Devices Meeting (IEDM), 8.1. 1-8.1. 4, 2015 | 23 | 2015 |
| Advanced metal and dielectric barrier cap films for Cu low k interconnects D Priyadarshini, S Nguyen, H Shobha, S Cohen, T Shaw, E Liniger, ... IEEE International Interconnect Technology Conference, 185-188, 2014 | 21 | 2014 |
| Compact tool for deposition of composition spread alloy films D Priyadarshini, P Kondratyuk, JB Miller, AJ Gellman Journal of Vacuum Science & Technology A 30 (1), 2012 | 20 | 2012 |
| Advanced single precursor based pSiCOH k= 2.4 for ULSI interconnects D Priyadarshini, SV Nguyen, H Shobha, E Liniger, JHC Chen, H Huang, ... Journal of Vacuum Science & Technology B 35 (2), 2017 | 19 | 2017 |
| Multilayer dielectric structures for semiconductor nano-devices A Grill, SL Knupp, SV Nguyen, VK Paruchuri, D Priyadarshini, HK Shobha US Patent 8,980,715, 2015 | 19 | 2015 |
| Segregation at the surfaces of CuxPd1− x alloys in the presence of adsorbed S JB Miller, D Priyadarshini, AJ Gellman Surface science 606 (19-20), 1520-1526, 2012 | 17 | 2012 |
| Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration S Skordas, DC La Tulipe, K Winstel, TA Vo, D Priyadarshini, A Upham, ... 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D …, 2012 | 16 | 2012 |
