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Co-authors
- Gongxun Bai (白功勋)China Jiliang UniversityVerified email at cjlu.edu.cn
- Wenjing JieThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Ming-Kiu TsangThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Zhibin YANGHong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Man Chung WongPost-Doc fellowVerified email at polyu.edu.hk
- Yang ZhangNankai UniversityVerified email at nankai.edu.cn
- zehan wuThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Sin Yi PangThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Feng GUOThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
- Long-Biao HuangCity University of Hong KongVerified email at my.cityu.edu.hk
- Xianhua WeiSouthwest University of Science and TechnologyVerified email at swust.edu.cn
- IO Weng FuStudent, The Hong Kong Polytechnic UniersityVerified email at connect.polyu.hk
- Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
- Zhenping WuBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Ran Ding (丁 然)Professor, College of Electronic Science and Engineering, Jilin UniversityVerified email at jlu.edu.cn
- Yongxin LyuPhD student, UNSWVerified email at ad.unsw.edu.au
- Huihong LinPostdoc. The Hong Kong Polytechnic UniversityVerified email at hstc.edu.cn
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Jianhua Hao (郝建华)
Chair Professor of Materials Physics and Devices, The Hong Kong Polytechnic University(香港理工大学)
Verified email at polyu.edu.hk - Homepage