Xiaoning Ye
Xiaoning Ye
Verified email at intel.com
Title
Cited by
Cited by
Year
Wide-band E-shaped patch antennas for wireless communications
F Yang, XX Zhang, X Ye, Y Rahmat-Samii
IEEE transactions on antennas and propagation 49 (7), 1094-1100, 2001
11842001
Signal integrity design for high-speed digital circuits: Progress and directions
J Fan, X Ye, J Kim, B Archambeault, A Orlandi
IEEE Transactions on Electromagnetic Compatibility 52 (2), 392-400, 2010
2282010
Crosstalk cancellation and/or reduction
X Ye
US Patent 9,293,798, 2016
1492016
EMI mitigation with multilayer power-bus stacks and via stitching of reference planes
X Ye, DA Hockanson, M Li, Y Ren, W Cui, JL Drewniak, RE DuBroff
IEEE Transactions on electromagnetic compatibility 43 (4), 538-548, 2001
1012001
Impact of copper surface texture on loss: A model that works
PG Huray, O Oluwafemi, J Loyer, E Bogatin, X Ye
DesignCon 2010 1, 462-483, 2010
852010
DC power-bus design using FDTD modeling with dispersive media and surface mount technology components
X Ye, MY Koledintseva, M Li, JL Drewniak
IEEE Transactions on Electromagnetic Compatibility 43 (4), 579-587, 2001
792001
FDTD and experimental investigation of EMI from stacked-card PCB configurations
DM Hockanson, X Ye, JL Drewniak, TH Hubing, TP Van Doren, ...
IEEE transactions on electromagnetic compatibility 43 (1), 1-10, 2001
522001
EMI resulting from signal via transitions through the DC power bus
W Cui, X Ye, B Archambeault, D White, M Li, JL Drewniak
IEEE International Symposium on Electromagnetic Compatibility. Symposium …, 2000
482000
A novel de-embedding method suitable for transmission-line measurement
B Chen, X Ye, B Samaras, J Fan
2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), 1-4, 2015
332015
Skew compensation by changing ground parasitic for traces
C Ye, X Ye
US Patent 7,450,396, 2008
332008
Analytical and numerical sensitivity analyses of fixtures de-embedding
B Chen, M Tsiklauri, C Wu, S Jin, J Fan, X Ye, B Samaras
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
312016
Incorporating two-port networks with S-parameters into FDTD
X Ye, JL Drewniak
IEEE microwave and wireless components letters 11 (2), 77-79, 2001
302001
High-performance inter-PCB connectors: Analysis of EMI characteristics
X Ye, JL Drewniak, J Nadolny, DM Hockanson
IEEE transactions on electromagnetic compatibility 44 (1), 165-174, 2002
292002
Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby
X Ye, D Miller, JD Bolen
US Patent 7,034,544, 2006
272006
Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations
S Jin, X Fang, B Chen, H Gao, X Ye, J Fan
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
262016
Improved “Root-Omega” method for transmission-line-based material property extraction for multilayer PCBs
S Jin, B Chen, X Fang, H Gao, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (4), 1356-1367, 2017
252017
Thru-reflect-line calibration technique: Error analysis for characteristic impedance variations in the line standards
L Ye, C Li, X Sun, S Jin, B Chen, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 59 (3), 779-788, 2016
242016
Error bounds analysis of de-embedded results in 2x thru de-embedding methods
C Wu, B Chen, T Mikheil, J Fan, X Ye
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
232017
A flexible and efficient bit error rate simulation method for high-speed differential link analysis using time-domain interpolation and superposition
K Xiao, B Lee, X Ye
2008 IEEE International Symposium on Electromagnetic Compatibility, 1-6, 2008
232008
Comparison of TRL calibration vs. 2x thru de-embedding methods
SJ Moon, X Ye, R Smith
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015
212015
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