| Direct Imprinting of Porous Silicon via Metal‐Assisted Chemical Etching BP Azeredo, YW Lin, A Avagyan, M Sivaguru, K Hsu, P Ferreira Advanced Functional Materials 26 (17), 2929-2939, 2016 | 73 | 2016 |
| Electrostatic compensation of structural imperfections in dynamically amplified dual-mass gyroscope A Efimovskaya, YW Lin, D Wang, AM Shkel Inertial Sensors and Systems (INERTIAL), 2017 IEEE International Symposium …, 2017 | 37 | 2017 |
| Quantification of Energy Dissipation Mechanisms in Toroidal Ring Gyroscope Y Wang, YW Lin, J Glaze, GD Vukasin, DD Shin, HK Kwon, DB Heinz, ... Journal of Microelectromechanical Systems, 2021 | 23 | 2021 |
| Origami-Like 3-D Folded MEMS Approach for Miniature Inertial Measurement Unit A Efimovskaya, YW Lin, AM Shkel Journal of Microelectromechanical Systems, 2017 | 22 | 2017 |
| Compensation of Systematic Errors in ZUPT-Aided Pedestrian Inertial Navigation Y Wang, YW Lin, S Askari, CS Jao, AM Shkel 2020 IEEE/ION Position, Location and Navigation Symposium (PLANS), 1452-1456, 2020 | 16 | 2020 |
| On ordering of fundamental wineglass modes in toroidal ring gyroscope A Efimovskaya, D Wang, YW Lin, AM Shkel SENSORS, 2016 IEEE, 1-3, 2016 | 15 | 2016 |
| On decoupled quantification of energy dissipation mechanisms in toroidal ring gyroscopes Y Wang, YW Lin, J Rodriguez, GD Vukasin, DD Shin, HK Kwon, DB Heinz, ... Solid-State Sensors, Actuators, and Microsystems Workshop (Hilton Head 2018 …, 2018 | 8 | 2018 |
| Study of environmental survivability and stability of Folded MEMS IMU YW Lin, A Efimovskaya, AM Shkel Inertial Sensors and Systems (INERTIAL), 2017 IEEE International Symposium …, 2017 | 4 | 2017 |
| On cross-talk between gyroscopes integrated on a folded MEMS IMU Cube A Efimovskaya, YW Lin, Y Yang, E Ng, Y Chen, I Flader, CH Ahn, V Hong, ... Micro Electro Mechanical Systems (MEMS), 2017 IEEE 30th International …, 2017 | 4 | 2017 |
| Double-Sided Process for MEMS SOI Sensors With Deep Vertical Thru-Wafer Interconnects A Efimovskaya, YW Lin, AM Shkel Journal of Microelectromechanical Systems 27 (2), 239-249, 2018 | 3 | 2018 |
| Thru-Wafer Interconnects for Double-Sided (TWIDS) fabrication of MEMS A Efimovskaya, YW Lin, AM Shkel Inertial Sensors and Systems, 2016 IEEE International Symposium on, 66-69, 2016 | 3 | 2016 |
Yusheng WangUC Irvine | SiTimeVerified email at uci.edu
