Shaohui Yong
Shaohui Yong
Marvell Technology, Inc.
Verified email at ieee.org
Title
Cited by
Cited by
Year
Dielectric dissipation factor (DF) extraction based on differential measurements and 2-D cross-sectional analysis
S Yong, Y Liu, H Gao, B Chen, S De, S Hinaga, D Yanagawa, J Drewniak, ...
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
162018
Integrated crosstalk noise (ICN) analysis among multiple differential BGA and via pairs by using design of experiments (DoE) method
B Chen, M Ouyang, S Yong, Y Wang, Y Bai, Y Zhou, J Fan
Electromagnetic Compatibility (EMC), 2017 IEEE International Symposium, 2017
142017
A comprehensive and practical way to look at crosstalk for transmission lines with mismatched terminals
S Yong, K Cai, B Sen, J Fan, V Khilkevich, C Sui
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
102018
Dielectric loss tangent extraction using modal measurements and 2-D cross-sectional analysis for multilayer PCBs
S Yong, V Khilkevich, Y Liu, H Gao, S Hinaga, S De, D Padilla, ...
IEEE Transactions on Electromagnetic Compatibility 62 (4), 1278-1292, 2020
92020
Comprehensive and practical way to look at far-end crosstalk for transmission lines with lossy conductor and dielectric
S Yong, V Khilkevich, XD Cai, C Sui, B Sen, J Fan
IEEE Transactions on Electromagnetic Compatibility 62 (2), 510-520, 2019
92019
Differential integrated crosstalk noise (ICN) reduction among multiple differential BGA and via pairs by using design of experiments (DoE) method
B Chen, M Ouyang, S Yong, Y Wang, J Wang, S Jin, Y Bai, Y Zhou, J Fan
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017
92017
A practical de-embedding error analysis method based on statistical circuit models of fixtures
S Yong, Y Liu, H Gao, S Hinaga, S De, D Padilla, D Yanagawa, ...
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
82019
Passive intermodulation source localization based on emission source microscopy
S Yong, S Yang, L Zhang, X Chen, DJ Pommerenke, V Khilkevich
IEEE Transactions on Electromagnetic Compatibility 62 (1), 266-271, 2019
62019
Mechanical magnetic field generator for communication in the ULF range
H Rezaei, V Khilkevich, S Yong, DS Stutts, D Pommerenke
IEEE Transactions on Antennas and Propagation 68 (3), 2332-2339, 2019
52019
Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance
B Chen, S Pan, J Wang, S Yong, M Ouyang, J Fan
IEEE Transactions on Electromagnetic Compatibility 61 (4), 1385-1394, 2019
52019
Scanning of random fields using blind source separation
Y Liu, J Li, S Yong, R He, V Khilkevich
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
42019
The Effect of the Parallel-Plate Mode on Striplines in Inhomogeneous Dielectric Media
J He, S Yong, Z Kiguradze, A Chada, B Mutnury, J Drewniak
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
32020
Resistance Modeling for Striplines with Different Surface Roughness on the Planes
S Yong, V Khilkevich, Y Liu, J He, H Gao, S Hinaga, D Padilla, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
32020
Modeling Strategy for EMI filters
R He, Y Xu, S Walunj, S Yong, V Khilkevich, D Pommerenke, HL Aichele, ...
IEEE Transactions on Electromagnetic Compatibility 62 (4), 1572-1581, 2020
32020
S-Parameter De-Embedding Error Estimation Based on the Statistical Circuit Models of Fixtures
Y Liu, S Yong, H Gao, S Hinaga, D Padilla, D Yanagawa, JL Drewniak, ...
IEEE Transactions on Electromagnetic Compatibility 62 (4), 1459-1467, 2020
32020
Modelling Strategy for Film Capacitors in EMI Filters
R He, SA Walunj, S Yong, V Khilkevich, D Pommerenke, H Aichele, ...
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
32019
Generic Modeling of Via-Stripline Structures in Multi-Layer Board for High Speed Applications
S Penugonda, S Yong, Y Wang, J Xu, K Cai, B Sen, J Fan
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
32019
Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines
Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
22020
Dielectric Material and Foil Surface Roughness Properties Extraction Based on Single-ended Measurements and Phase Constant () Fitting
S Yong, V Khilkevich, S Penugonda, XD Cai, Q Gao, B Sen, H Gao, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
22020
Automatic sparse ESM scan using Gaussian process regression
J Li, J Zhou, S Yong, Y Liu, V Khilkevich
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
22020
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