Joungho Kim
Joungho Kim
Professor of Electrical Engineering KAIST
Verified email at kaist.ac.kr - Homepage
Title
Cited by
Cited by
Year
Coil design and shielding methods for a magnetic resonant wireless power transfer system
J Kim, J Kim, S Kong, H Kim, IS Suh, NP Suh, DH Cho, J Kim, S Ahn
Proceedings of the IEEE 101 (6), 1332-1342, 2013
4692013
High-Frequency Scalable Electrical Model and Analysis of Through Silicon Via (TSV)
J Kim, JS Pak, J Cho, E Song, J Cho, H Kim, T Song, J Lee, H Lee, K Park, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
4252011
Power distribution networks for system-on-package: Status and challenges
M Swaminathan, J Kim, I Novak, JP Libous
IEEE Transactions on Advanced Packaging 27 (2), 286-300, 2004
3192004
Development and evaluation of 3-D SiP with vertically interconnected through silicon vias (TSV)
DM Jang, C Ryu, KY Lee, BH Cho, J Kim, TS Oh, WJ Lee, J Yu
2007 proceedings 57th electronic components and technology conference, 847-852, 2007
2342007
3D-MAPS: 3D massively parallel processor with stacked memory
SK Lim
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits …, 2013
2092013
Modeling and Analysis of Through Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ...
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
1672011
Magnetic field design for high efficient and low EMF wireless power transfer in on-line electric vehicle
S Ahn, J Kim
Proceedings of the 5th European Conference on Antennas and Propagation …, 2011
1592011
Coil design and measurements of automotive magnetic resonant wireless charging system for high-efficiency and low magnetic field leakage
H Kim, C Song, DH Kim, DH Jung, IM Kim, YI Kim, J Kim, S Ahn, J Kim
IEEE Transactions on Microwave Theory and Techniques 64 (2), 383-400, 2016
1552016
PDN Impedance Modeling and Analysis of a 3D TSV IC by Using a Proposed P/G TSV Array Model based on Separated P/G TSV and Chip-PDN Models
JS Pak, J Kim, J Cho, K Kim, T Song, S Ahn, J Lee, H Lee, K Park, J Kim
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
1362011
Low frequency electromagnetic field reduction techniques for the on-line electric vehicle (OLEV)
S Ahn, J Pak, T Song, H Lee, JG Byun, D Kang, CS Choi, E Kim, J Ryu, ...
2010 IEEE International Symposium on Electromagnetic Compatibility, 625-630, 2010
1312010
Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure
J Shim, DG Kam, JH Kwon, J Kim
IEEE transactions on electromagnetic compatibility 52 (3), 566-577, 2010
1202010
Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation
JS Pak, C Ryu, J Kim
2007 International Conference on Electronic Materials and Packaging, 1-6, 2007
1132007
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
C Liu, T Song, J Cho, J Kim, J Kim, SK Lim
2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC), 783-788, 2011
1062011
High frequency electrical model of through wafer via for 3-D stacked chip packaging
C Ryu, J Lee, H Lee, K Lee, T Oh, J Kim
2006 1st Electronic Systemintegration Technology Conference 1, 215-220, 2006
1032006
Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method
J Kim, W Lee, Y Shim, J Shim, K Kim, JS Pak, J Kim
IEEE Transactions on advanced packaging 33 (3), 647-659, 2010
872010
System-on-package ultra-wideband transmitter using CMOS impulse generator
J Lee, YJ Park, M Kim, C Yoon, J Kim, KH Kim
IEEE Transactions on Microwave Theory and Techniques 54 (4), 1667-1674, 2006
872006
Modeling and measurement of simultaneous switching noise coupling through signal via transition
J Park, H Kim, Y Jeong, J Kim, JS Pak, DG Kam, J Kim
IEEE Transactions on Advanced Packaging 29 (3), 548-559, 2006
862006
Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer
K Yoon, G Kim, W Lee, T Song, J Lee, H Lee, K Park, J Kim
2009 11th Electronics Packaging Technology Conference, 702-706, 2009
852009
Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards
J Kim, MD Rotaru, S Baek, J Park, MK Iyer, J Kim
IEEE Transactions on Electromagnetic Compatibility 48 (2), 319-330, 2006
692006
Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications
J Park, ACW Lu, KM Chua, LL Wai, J Lee, J Kim
IEEE Microwave and Wireless Components Letters 16 (9), 481-483, 2006
682006
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