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Donggun "Don" Kam
Donggun "Don" Kam
Verified email at qti.qualcomm.com
Title
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Cited by
Year
A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications
A Natarajan, SK Reynolds, MD Tsai, ST Nicolson, JHC Zhan, DG Kam, ...
IEEE Journal of Solid-State Circuits 46 (5), 1059-1075, 2011
4042011
A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60-GHz communications
A Valdes-Garcia, ST Nicolson, JW Lai, A Natarajan, PY Chen, ...
Solid-State Circuits, IEEE Journal of 45 (12), 2757-2773, 2010
2892010
Integrated antenna for RFIC package applications
DG Kam, D Liu, SK Reynolds
US Patent 8,988,299, 2015
1392015
LTCC packages with embedded phased-array antennas for 60 GHz communications
DG Kam, D Liu, A Natarajan, S Reynolds, HC Chen, BA Floyd
IEEE Microwave and Wireless Components Letters 21 (3), 142-144, 2011
1392011
Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure
J Shim, DG Kam, JH Kwon, J Kim
IEEE Transactions on Electromagnetic Compatibility 52 (3), 566-577, 2010
1292010
Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets
DG Kam, D Liu, A Natarajan, SK Reynolds, BA Floyd
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
1282011
Is 25 Gb/s on-board signaling viable?
DG Kam, MB Ritter, TJ Beukema, JF Bulzacchelli, PK Pepeljugoski, ...
IEEE Transactions on advanced packaging 32 (2), 328-344, 2009
972009
Modeling and measurement of simultaneous switching noise coupling through signal via transition
J Park, H Kim, Y Jeong, J Kim, JS Pak, DG Kam, J Kim
IEEE Transactions on Advanced Packaging 29 (3), 548-559, 2006
882006
Integrated antenna for RFIC package applications
DG Kam, D Liu, SK Reynolds
US Patent 9,172,132, 2015
722015
Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications
A Valdes-Garcia, S Reynolds, A Natarajan, D Kam, D Liu, JW Lai, ...
IEEE Communications Magazine 49 (4), 120-131, 2011
622011
A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS
SK Reynolds, AS Natarajan, MD Tsai, S Nicolson, JHC Zhan, D Liu, ...
2010 IEEE Radio Frequency Integrated Circuits Symposium, 461-464, 2010
622010
Spread spectrum clock generator with delay cell array to reduce electromagnetic interference
J Kim, DG Kam, PJ Jun, J Kim
IEEE transactions on electromagnetic compatibility 47 (4), 908-920, 2005
592005
Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission
DG Kam, H Lee, J Kim
IEEE transactions on advanced packaging 27 (4), 590-596, 2004
512004
Low-cost antenna-in-package solutions for 60-GHz phased-array systems
DG Kam, D Liu, A Natarajan, S Reynolds, BA Floyd
19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010
502010
Thermal interface material application for integrated circuit cooling
MA Gaynes, DG Kam, D Liu, SK Reynolds
US Patent 8,411,444, 2013
482013
Multiport measurement method using a two-port network analyzer with remaining ports unterminated
DG Kam, J Kim
Microwave and Wireless Components Letters, IEEE 17 (9), 694-696, 2007
442007
40-Gb/s package design using wire-bonded plastic ball grid array
DG Kam, J Kim
IEEE Transactions on Advanced Packaging 31 (2), 258-266, 2008
422008
Introducing a Mixed-Mode Matrix for Investigation of Wireless Communication Related to Orbital Angular Momentum
W Park, L Wang, HD Brüns, DG Kam, C Schuster
IEEE Transactions on Antennas and Propagation 67 (3), 1719-1728, 2019
372019
Biocompatible, optically transparent, patterned, and flexible electrodes and radio-frequency antennas prepared from silk protein and silver nanowire networks
K Min, M Umar, H Seo, JH Yim, DG Kam, H Jeon, S Lee, S Kim
RSC Advances 7 (1), 574-580, 2017
352017
RF interconnect for multi-Gbit/s board-level clock distribution
W Ryu, J Lee, H Kim, S Ahn, N Kim, B Choi, D Kam, J Kim
IEEE transactions on advanced packaging 23 (3), 398-407, 2000
352000
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Articles 1–20