| 6G: The next frontier: From holographic messaging to artificial intelligence using subterahertz and visible light communication EC Strinati, S Barbarossa, JL Gonzalez-Jimenez, D Ktenas, N Cassiau, ... IEEE Vehicular Technology Magazine 14 (3), 42-50, 2019 | 723 | 2019 |
| Millimeter-wave access and backhauling: The solution to the exponential data traffic increase in 5G mobile communications systems? C Dehos, JL González, A De Domenico, D Ktenas, L Dussopt IEEE communications magazine 52 (9), 88-95, 2014 | 526 | 2014 |
| A 65-nm CMOS fully integrated transceiver module for 60-GHz wireless HD applications A Siligaris, O Richard, B Martineau, C Mounet, F Chaix, R Ferragut, ... IEEE Journal of Solid-State Circuits 46 (12), 3005-3017, 2011 | 227 | 2011 |
| A 17.5-to-20.94 GHz and 35-to-41.88 GHz PLL in 65nm CMOS for wireless HD applications O Richard, A Siligaris, F Badets, C Dehos, C Dufis, P Busson, P Vincent, ... 2010 IEEE International Solid-State Circuits Conference-(ISSCC), 252-253, 2010 | 95 | 2010 |
| Silicon interposer with integrated antenna array for millimeter-wave short-range communications L Dussopt, Y Lamy, S Joblot, J Lanteri, H Salti, P Bar, H Sibuet, B Reig, ... 2012 IEEE/MTT-S International Microwave Symposium Digest, 1-3, 2012 | 39 | 2012 |
| Silicon interposer: A versatile platform towards full-3D integration of wireless systems at millimeter-wave frequencies O El Bouayadi, L Dussopt, Y Lamy, C Dehos, C Ferrandon, A Siligaris, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 973-980, 2015 | 37 | 2015 |
| A 12 Gb/s 64QAM and OFDM compatible millimeter-wave communication link using a novel plastic waveguide design F Voineau, C Dehos, B Martineau, M Sié, M Perchicot, NH Nguyen, ... 2018 IEEE Radio and Wireless Symposium (RWS), 250-252, 2018 | 33 | 2018 |
| A Wideband and High-Linearity E-B and Transmitter Integrated in a 55-nm SiGe Technology for Backhaul Point-to-Point 10-Gb/s Links D del Rio, I Gurutzeaga, A Rezola, JF Sevillano, I Velez, SE Gunnarsson, ... IEEE Transactions on Microwave Theory and Techniques 65 (8), 2990-3001, 2017 | 29 | 2017 |
| A 125.5-157 GHz 8 dB NF and 16 dB of gain D-band low noise amplifier in CMOS SOI 45 nm A Hamani, A Siligaris, B Blampey, C Dehos, JLG Jimenez 2020 IEEE/MTT-S International Microwave Symposium (IMS), 197-200, 2020 | 27 | 2020 |
| A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications Y Lamy, L Dussopt, O El Bouayadi, C Ferrandon, A Siligaris, C Dehos, ... 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2013 | 25 | 2013 |
| 6G: The next frontier E Calvanese Strinati, S Barbarossa, JL Gonzalez-Jimenez, D Kténas, ... arXiv e-prints, arXiv: 1901.03239, 2019 | 24 | 2019 |
| An 84.48 Gb/s CMOS D-band multi-channel TX system-in-package A Hamani, F Foglia-Manzillo, A Siligaris, N Cassiau, B Blampey, ... 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 207-210, 2021 | 23* | 2021 |
| A 84.48-Gb/s 64-QAM CMOS D-band channel-bonding Tx front-end with integrated multi-LO frequency generation A Hamani, A Siligaris, F Barrera, C Dehos, N Cassiau, B Blampey, ... IEEE Solid-State Circuits Letters 3, 346-349, 2020 | 23 | 2020 |
| A multichannel programmable high order frequency multiplier for channel bonding and full duplex transceivers at 60 GHz band A Siligaris, JL Gonzalez-Jimenez, C Jany, B Blampey, A Boulmirat, ... 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 259-262, 2020 | 22 | 2020 |
| Digital compensation of amplifier nonlinearities in the receiver of a wireless system C Dehos, TCW Schenk 2007 14th IEEE Symposium on Communications and Vehicular Technology in the …, 2007 | 18 | 2007 |
| V-band transceiver modules with integrated antennas and phased arrays for mmWave access in 5G mobile networks L Marnat, L Dussopt, V Puyal, A Siligaris, F Hameau, A Larie, C Dehos 2017 11th European Conference on Antennas and Propagation (EUCAP), 2786-2790, 2017 | 17 | 2017 |
| Low-cost fully integrated BiCMOS transceiver for pulsed 24-GHz automotive radar sensors L Moquillon, P Garcia, S Pruvost, S Le Tual, M Marchetti, L Chabert, ... 2008 IEEE Custom Integrated Circuits Conference, 475-478, 2008 | 15 | 2008 |
| Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links JL Gonzalez-Jimenez, C Dehos, N Cassiau, A Siligaris, A Clemente, ... EURASIP Journal on Wireless Communications and Networking 2020, 1-21, 2020 | 13 | 2020 |
| Making 5G millimeter-wave communications a reality [Industry Perspectives] A De Domenico, R Gerzaguet, N Cassiau, A Clemente, R D'Errico, ... IEEE Wireless Communications 24 (4), 4-9, 2017 | 13 | 2017 |
| Low-cost, high-gain antenna module integrating a CMOS frequency multiplier driver for communications at D-band FF Manzillo, JL Gonzalez-Jimenez, A Clemente, A Siligaris, B Blampey, ... 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC), 19-22, 2019 | 12 | 2019 |
