| Delphi-like dynamical compact thermal models using model order reduction B Rogié, L Codecasa, E Monier-Vinard, V Bissuel, N Laraqi, O Daniel, ... 2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017 | 33 | 2017 |
| Novel approach to the extraction of Delphi-like boundary-condition-independent compact thermal models of planar transformer devices V Bissuel, L Codecasa, E Monier-Vinard, B Rogié, A Olivier, A Mahé, ... 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 25 | 2018 |
| Latest developments of compact thermal modeling of system-in-package devices by means of Genetic Algorithm E Monier-Vinard, V Bissuel, N Laraqi, C Dia Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 24 | 2014 |
| Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization B Rogié, L Codecasa, E Monier-Vinard, V Bissuel, N Laraqi, O Daniel, ... Microelectronics Reliability 87, 222-231, 2018 | 22 | 2018 |
| Analytical modeling of multi-layered Printed Circuit Board dedicated to electronic component thermal characterization E Monier-Vinard, N Laraqi, CT Dia, MN Nguyen, V Bissuel Solid-State Electronics 103, 30-39, 2015 | 22 | 2015 |
| Natural convection in inclined hemispherical cavities with isothermal disk and dome faced downwards. Experimental and numerical study A Baïri, E Monier-Vinard, N Laraqi, I Baïri, MN Nguyen, CT Dia Applied thermal engineering 73 (1), 1340-1347, 2014 | 21 | 2014 |
| Extension of the DELPHI methodology to Dynamic Compact Thermal Model of electronic Component E Monier-Vinard, CT Dia, V Bissuel, O Daniel, N Laraqi 2011 17th International Workshop on Thermal Investigations of ICs and …, 2011 | 21 | 2011 |
| Analytical thermal modelling of multilayered active embedded chips into high density electronic board E Monier-Vinard, N Laraqi, CT Dia, MN Nguyen, V Bissuel Thermal Science 17 (3), 695-706, 2013 | 20 | 2013 |
| Delphi style compact modeling for multi-chip package including its bottom board area based on genetic algorithm optimization E Monier-vinard, V Bissuel, P Murphy, O Daniel, J Dufrenne 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 20 | 2010 |
| Industrial PCB development using embedded passive & active discrete chips focused on process and DfR1 M Brizoux, A Grivon, WC Maia Filho, E Monier-Vinard, J Stahr, M Morianz PLUS. Produktion von Leiterplatten und Systemen 12 (11), 2670, 2010 | 19 | 2010 |
| State of the art of thermal characterization of electronic components using computational fluid dynamic tools E Monier-Vinard, B Rogie, V Bissuel, N Laraqi, O Daniel, MC Kotelon International Journal of Numerical Methods for Heat & Fluid Flow 27 (11 …, 2017 | 18 | 2017 |
| Dynamic compact thermal model for stacked-die components E Monier-Vinard, CT Dia, V Bissuel, N Laraqi, O Daniel 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management …, 2012 | 15 | 2012 |
| Thermal modelling of the emerging multi-chip packages E Monier-Vinard, V Bissuel, P Murphy, O Daniel, J Dufrenne 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010 | 15 | 2010 |
| Electronic Board modeling by the means of DELPHI Compact Thermal Model of Components E Monier-Vinard, V Bissuel, CT Dia, O Daniel, N Laraqi 20th International Workshop on Thermal Investigations of ICs and Systems, 1-5, 2014 | 13 | 2014 |
| New analytical solution for solving steady-state heat conduction problems with singularities N Laraqi, E Monier-Vinard Thermal Science 17 (3), 665-672, 2013 | 13 | 2013 |
| Experimental Characterization of MOR-based and Delphi-like BCI DCTMs E Monier-Vinard, L Codecasa, B Rogié, V Bissuel, N Laraqi, ... 2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018 | 12 | 2018 |
| Impact of printed circuit board via and micro-via structures on component thermal performances V Bissuel, M Brizoux, A Grivon, E Monier-Vinard, F Pires | 12 | 2011 |
| Multi-port Dynamic Compact Thermal Models of BGA package using Model Order Reduction and Metaheuristic Optimization V Bissuel, V Fox, E Monier-Vinard, A Neveu, F Joly, O Daniel 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 11 | 2019 |
| Practical analytical modeling of 3D multi-layer Printed Wired Board with buried volumetric heating sources B Rogié, E Monier-Vinard, MN Nguyen, V Bissuel, N Laraqi International Journal of Thermal Sciences 129, 404-415, 2018 | 11 | 2018 |
| Delphi style compact modeling by means of genetic algorithms of system in Package devices using composite sub-compact thermal models dedicated to model order reduction E Monier-Vinard, V Bissuel, C Dia, O Daniel 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 10 | 2012 |
Brice RogieTechnical University of DenmarkVerified email at mek.dtu.dk
