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Lucile Broussous
Lucile Broussous
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A multi-wavelength 3D-compatible silicon photonics platform on 300mm SOI wafers for 25Gb/s applications
F Boeuf, S Crémer, N Vulliet, T Pinguet, A Mekis, G Masini, L Verslegers, ...
2013 IEEE International Electron Devices Meeting, 13.3. 1-13.3. 4, 2013
1032013
Selective catalytic reduction of nitrogen monoxide by decane on copper-exchanged beta zeolites
G Delahay, B Coq, L Broussous
Applied Catalysis B: Environmental 12 (1), 49-59, 1997
791997
SAXS study of formation and growth of tin oxide nanoparticles in the presence of complexing ligands
L Broussous, CV Santilli, SH Pulcinelli, AF Craievich
The Journal of Physical Chemistry B 106 (11), 2855-2860, 2002
642002
Effect of plasma treatments on a porous low-k material–Study of pore sealing
W Puyrenier, V Rouessac, L Broussous, D Rébiscoul, A Ayral
Microporous and mesoporous materials 106 (1-3), 40-48, 2007
482007
Microfiltration of beer yeast suspensions through stamped ceramic membranes
J Stopka, SG Bugan, L Broussous, Š Schlosser, A Larbot
Separation and Purification Technology 25 (1-3), 535-543, 2001
472001
Image sensor with a curved surface
F Roy, L Broussous, J Michelot, JP Oddou
US Patent 9,099,604, 2015
412015
Structure of SnO2 alcosols and films prepared by sol–gel dip coating
AP Rizzato, L Broussous, CV Santilli, SH Pulcinelli, AF Craievich
Journal of non-crystalline solids 284 (1-3), 61-67, 2001
402001
Hydrodynamic aspects of filtration antifouling by helically corrugated membranes
L Broussous, P Schmitz, H Boisson, E Prouzet, A Larbot
Chemical Engineering Science 55 (21), 5049-5057, 2000
402000
Electrochemical behavior of copper and cobalt in post-etch cleaning solutions
S Bilouk, L Broussous, RP Nogueira, V Ivanova, C Pernel
Microelectronic Engineering 86 (10), 2038-2044, 2009
382009
Integration of Cu/SiOC in Cu dual damascene interconnect for 0.1-μm technology
M Fayolle, J Torres, G Passemard, F Fusalba, G Fanget, D Louis, ...
Microelectronic Engineering 64 (1-4), 35-42, 2002
372002
Stamped ceramic porous tubes for tangential filtration
L Broussous, JC Ruiz, A Larbot, L Cot
Separation and purification technology 14 (1-3), 53-57, 1998
311998
Characterization of the impact of plasma treatments and wet cleaning on a porous low k material
W Puyrenier, V Rouessac, L Broussous, D Rébiscoul, A Ayral
Microelectronic engineering 83 (11-12), 2314-2318, 2006
292006
Porosity and structure evolution of a SiOCH low k material during post-etch cleaning process
L Broussous, W Puyrenier, D Rebiscoul, V Rouessac, A Ayral
Microelectronic engineering 84 (11), 2600-2605, 2007
282007
General review of issues and perspectives for advanced copper interconnections using air gap as ultra-low K material
LG Gosset, V Arnal, C Prindle, R Hoofman, G Verheijden, R Daamen, ...
Proceedings of the IEEE 2003 International Interconnect Technology …, 2003
282003
Low cost 300mm double-SOI substrate for low insertion loss 1D & 2D grating couplers
C Baudot, D Dutartre, A Souhaité, N Vulliet, A Jones, M Ries, A Mekis, ...
11th International Conference on Group IV Photonics (GFP), 137-138, 2014
252014
Mechanical properties of a plasma-modified porous low-k material
L Broussous, G Berthout, D Rebiscoul, V Rouessac, A Ayral
Microelectronic Engineering 87 (3), 466-469, 2010
242010
Post-etch cleaning chemistries evaluation for low k-copper integration
L Broussous, O Hinsinger, S Favier, P Besson
Solid State Phenomena 92, 263-266, 2003
242003
An experimental study of helically stamped ceramic microfiltration membranes using bentonite suspensions
L Broussous, E Prouzet, L Beque, A Larbot
Separation and purification technology 24 (1-2), 205-221, 2001
232001
Predicting adsorption on bare and modified silica surfaces
M Lépinay, L Broussous, C Licitra, F Bertin, V Rouessac, A Ayral, ...
The Journal of Physical Chemistry C 119 (11), 6009-6017, 2015
192015
High performance k= 2.5 ULK backend solution using an improved TFHM architecture, extendible to the 45nm technology node
R Fox, O Hinsinger, E Richard, E Sabouret, T Berger, C Goldberg, ...
IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest., 81-84, 2005
152005
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