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Co-authors
Eric PopStanford University, Electrical Engineering, Materials Science & EngineeringVerified email at stanford.edu
David EstradaAssociate Professor of Materials Science and Engineering, Boise State UniversityVerified email at boisestate.edu
Feng XiongAssistant Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
Zuanyi LiASMLVerified email at illinois.edu
David G. CahillDepartment of Materials Science and Engineering, University of Illinois at Urbana-ChampaignVerified email at illinois.edu
Yee Kan KOHNational University of SingaporeVerified email at nus.edu.sg
Young Duck KimAssistant Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaVerified email at khu.ac.kr
Ashkan BehnamDevice/Process Integration Engineer, IntelVerified email at intel.com
Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University ofVerified email at illinois.edu
Sharnali IslamUniversity of DhakaVerified email at illinois.edu
Rashid BashirDean College of Engineering, Grainger Distinguished Chair, Dept of BioengineeringVerified email at illinois.edu
Jae Cheol ShinAssociate professor in department of physics at Yeungnam UniversityVerified email at yu.ac.kr
Enrique CarrionIntelVerified email at intel.com
Won Il ParkProfessor of Materials Science and Engineering, Hanyang UniversityVerified email at hanyang.ac.kr
Yonggang HuangWalter P. Murphy Professor of M.E., C.E.E. and M.S.E., Northwestern UniversityVerified email at northwestern.edu
Shafiqul IslamProfessor, Civil and Environmental Engineering, Water Diplomacy, Tufts UniversityVerified email at tufts.edu
Myung-Ho Bae
Korea Research Institute of Standards and Science, mhbae@kriss.re.kr
Verified email at kriss.re.kr