Hai Wei
Hai Wei
Verified email at stanford.edu
Title
Cited by
Cited by
Year
Carbon nanotube computer
MM Shulaker, G Hills, N Patil, H Wei, HY Chen, HSP Wong, S Mitra
Nature 501 (7468), 526-530, 2013
9202013
VMR: VLSI-compatible metallic carbon nanotube removal for imperfection-immune cascaded multi-stage digital logic circuits using carbon nanotube FETs
N Patil, A Lin, J Zhang, H Wei, K Anderson, HSP Wong, S Mitra
2009 IEEE International Electron Devices Meeting (IEDM), 1-4, 2009
1092009
Carbon nanotube circuit integration up to sub-20 nm channel lengths
MM Shulaker, J Van Rethy, TF Wu, L Suriyasena Liyanage, H Wei, Z Li, ...
ACS nano 8 (4), 3434-3443, 2014
852014
Linear increases in carbon nanotube density through multiple transfer technique
MM Shulaker, H Wei, N Patil, J Provine, HY Chen, HSP Wong, S Mitra
Nano letters 11 (5), 1881-1886, 2011
852011
Robust digital VLSI using carbon nanotubes
J Zhang, A Lin, N Patil, H Wei, L Wei, HS Wong, S Mitra
IEEE Transactions on Computer-aided Design of integrated circuits and …, 2012
772012
Sensor-to-digital interface built entirely with carbon nanotube FETs
MM Shulaker, J Van Rethy, G Hills, H Wei, HY Chen, G Gielen, ...
IEEE Journal of Solid-State Circuits 49 (1), 190-201, 2013
672013
Scalable carbon nanotube computational and storage circuits immune to metallic and mispositioned carbon nanotubes
N Patil, A Lin, J Zhang, H Wei, K Anderson, HSP Wong, S Mitra
IEEE Transactions on Nanotechnology 10 (4), 744-750, 2010
672010
Carbon nanotube robust digital VLSI
J Zhang, A Lin, N Patil, H Wei, L Wei, HSP Wong, S Mitra
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2012
592012
ACCNT—A metallic-CNT-tolerant design methodology for carbon-nanotube VLSI: Concepts and experimental demonstration
A Lin, N Patil, H Wei, S Mitra, HSP Wong
IEEE Transactions on Electron Devices 56 (12), 2969-2978, 2009
532009
Carbon nanotube electronics-materials, devices, circuits, design, modeling, and performance projection
HSP Wong, S Mitra, D Akinwande, C Beasley, Y Chai, HY Chen, X Chen, ...
2011 International Electron Devices Meeting, 23.1. 1-23.1. 4, 2011
422011
Monolithic 3D integration: A path from concept to reality
MM Shulaker, TF Wu, MM Sabry, H Wei, HSP Wong, S Mitra
2015 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2015
412015
Cooling three-dimensional integrated circuits using power delivery networks
H Wei, TF Wu, D Sekar, B Cronquist, RF Pease, S Mitra
2012 International Electron Devices Meeting, 14.2. 1-14.2. 4, 2012
402012
Efficient metallic carbon nanotube removal readily scalable to wafer-level VLSI CNFET circuits
H Wei, N Patil, J Zhang, A Lin, HY Chen, HSP Wong, S Mitra
2010 Symposium on VLSI Technology, 237-238, 2010
362010
A metallic-CNT-tolerant carbon nanotube technology using asymmetrically-correlated CNTs (ACCNT)
A Lin, N Patil, H Wei, S Mitra, HSP Wong
2009 Symposium on VLSI Technology, 182-183, 2009
362009
Rapid co-optimization of processing and circuit design to overcome carbon nanotube variations
G Hills, J Zhang, MM Shulaker, H Wei, CS Lee, A Balasingam, HSP Wong, ...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015
352015
Monolithic three-dimensional integration of carbon nanotube FET complementary logic circuits
H Wei, M Shulaker, HSP Wong, S Mitra
2013 IEEE International Electron Devices Meeting, 19.7. 1-19.7. 4, 2013
332013
ACCNT: A metallic-CNT-tolerant design methodology for carbon nanotube VLSI: Analyses and design guidelines
A Lin, J Zhang, N Patil, H Wei, S Mitra, HSP Wong
IEEE transactions on electron devices 57 (9), 2284-2295, 2010
332010
Monolithic three-dimensional integrated circuits using carbon nanotube FETs and interconnects
H Wei, N Patil, A Lin, HSP Wong, S Mitra
2009 IEEE International Electron Devices Meeting (IEDM), 1-4, 2009
332009
Monolithic 3D integration advances and challenges: From technology to system levels
MS Ebrahimi, G Hills, MM Sabry, MM Shulaker, H Wei, TF Wu, S Mitra, ...
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S …, 2014
212014
Rapid exploration of processing and design guidelines to overcome carbon nanotube variations
G Hills, J Zhang, C Mackin, M Shulaker, H Wei, HSP Wong, S Mitra
2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC), 1-10, 2013
212013
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