Mikhail Krishtab
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Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics
M Krishtab, I Stassen, T Stassin, AJ Cruz, OO Okudur, S Armini, C Wilson, ...
Nature Communications 10 (1), 3729, 2019
Low-k films modification under EUV and VUV radiation
TV Rakhimova, AT Rakhimov, YA Mankelevich, DV Lopaev, AS Kovalev, ...
Journal of Physics D: Applied Physics 47 (2), 025102, 2013
Selective Ru ALD as a catalyst for sub-seven-nanometer bottom-up metal interconnects
I Zyulkov, M Krishtab, S De Gendt, S Armini
ACS applied materials & interfaces 9 (36), 31031-31041, 2017
Integrated cleanroom process for the vapor-phase deposition of large-area zeolitic imidazolate framework thin films
AJ Cruz, I Stassen, M Krishtab, K Marcoen, T Stassin, ...
Chemistry of Materials 31 (22), 9462-9471, 2019
Porosimetry for Thin Films of Metal–Organic Frameworks: A Comparison of Positron Annihilation Lifetime Spectroscopy and Adsorption‐Based Methods
T Stassin, R Verbeke, AJ Cruz, S Rodríguez‐Hermida, I Stassen, ...
Advanced Materials 33 (17), 2006993, 2021
Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers
Y Sun, M Krishtab, H Struyf, P Verdonck, S De Feyter, MR Baklanov, ...
Langmuir 30 (13), 3832-3844, 2014
Fractally aggregated micro-and nanosystems synthesized from sols
IE Kononova, VA Moshnikov, MB Krishtab, IA Pronin
Glass Physics and Chemistry 40, 190-202, 2014
Study of chemical vapor deposition of manganese on porous SiCOH low-k dielectrics using Bis (ethylcyclopentadienyl) manganese
N Jourdan, MB Krishtab, MR Baklanov, J Meersschaut, CJ Wilson, ...
Electrochemical and Solid-State Letters 15 (5), H176, 2012
Pore sealing of porous ultralow-k dielectrics by self-assembled monolayers combined with atomic layer deposition
S Armini, JL Prado, J Swerts, Y Sun, M Krishtab, J Meersschaut, M Blauw, ...
ECS Solid State Letters 1 (2), P42, 2012
Effect of porosity and pore size on dielectric constant of organosilicate based low-k films: An analytical approach
AP Palov, EN Voronina, TV Rakhimova, DV Lopaev, SM Zyryanov, ...
Journal of Vacuum Science & Technology B 34 (4), 2016
Pore sealing of k 2.0 dielectrics assisted by self-assembled monolayers deposited from vapor phase
S Armini, JL Prado, M Krishtab, J Swerts, P Verdonck, J Meersschaut, ...
Microelectronic engineering 120, 240-245, 2014
Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young’s modulus
P Verdonck, C Wang, QT Le, L Souriau, K Vanstreels, M Krishtab, ...
Microelectronic engineering 120, 225-229, 2014
Vacuum ultra-violet damage and damage mitigation for plasma processing of highly porous organosilicate glass dielectrics
JF de Marneffe, L Zhang, M Heyne, M Lukaszewicz, SB Porter, F Vajda, ...
Journal of Applied Physics 118 (13), 2015
Dependence of dielectric constant of SiOCH low-k films on porosity and pore size
A Palov, TV Rakhimova, MB Krishtab, MR Baklanov
Journal of Vacuum Science & Technology B 33 (2), 2015
On-chip interconnect trends, challenges and solutions: how to keep RC and reliability under control
Z Tőkei, I Ciofi, P Roussel, P Debacker, P Raghavan, MH Van Der Veen, ...
2016 IEEE Symposium on VLSI Technology, 1-2, 2016
Effect of the C-bridge length on the ultraviolet-resistance of oxycarbosilane low-k films
M Redzheb, L Prager, S Naumov, M Krishtab, S Armini, P Van Der Voort, ...
Applied Physics Letters 108 (1), 2016
Plasma induced damage mitigation in spin-on self-assembly based ultra low-k dielectrics using template residues
M Krishtab, JF De Marneffe, S De Gendt, MR Baklanov
Applied Physics Letters 110 (1), 2017
Surface-confined activation of ultra low-k dielectrics in CO2 plasma
Y Sun, M Krishtab, Y Mankelevich, L Zhang, S De Feyter, M Baklanov, ...
Applied Physics Letters 108 (26), 2016
UV cure of oxycarbosilane low-k films
M Redzheb, L Prager, M Krishtab, S Armini, K Vanstreels, A Franquet, ...
Microelectronic Engineering 156, 103-107, 2016
On the mechanical and electrical properties of self-assembly-based organosilicate porous films
M Redzheb, S Armini, T Berger, M Jacobs, M Krishtab, K Vanstreels, ...
Journal of Materials Chemistry C 5 (33), 8599-8607, 2017
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