| Thickness dependence of the resistivity of platinum-group metal thin films S Dutta, K Sankaran, K Moors, G Pourtois, SV Elshocht, J Bömmels, ... Journal of Applied Physics 122 (2), 2017 | 185 | 2017 |
| Atomic Layer Deposition of Ruthenium with TiN interface for sub-10 nm advanced interconnects beyond Copper LG Wen, P Roussel, OV Pedreira, B Briggs, B Groven, S Dutta, ... ACS Applied Materials & Interfaces 8 (39), 26119-26125, 2016 | 105 | 2016 |
| Highly Scaled Ruthenium Interconnects S Dutta, S Kundu, A Gupta, G Jamieson, JFG Granados, J Bömmels, ... IEEE Electron Device Letters 38 (7), 949-951, 2017 | 83 | 2017 |
| Ruthenium metallization for advanced interconnects LG Wen, C Adelmann, OV Pedreira, S Dutta, M Popovici, B Briggs, ... 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 74 | 2016 |
| Finite Size Effects in Highly Scaled Ruthenium Interconnects S Dutta, K Moors, M Vandemaele, C Adelmann IEEE Electron Device Letters 39 (2), 268 - 271, 2018 | 58 | 2018 |
| Sub-100 nm 2 Cobalt Interconnects S Dutta, S Beyne, A Gupta, S Kundu, S Van Elshocht, G Jamieson, ... IEEE Electron Device Letters 39 (5), 731 - 734, 2018 | 57 | 2018 |
| Atomic Layer Deposition of Ruthenium Thin Films from (ethylbenzyl)(1-ethyl-1, 4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties M Popovici, B Groven, K Marcoen, QM Phung, S Dutta, J Swerts, ... Chemistry of Materials 29 (11), 4654–4666, 2017 | 52 | 2017 |
| Alternative Metals: From AB Initio Screening to Calibrated Narrow Line Models C Adelmann, K Sankaran, S Dutta, A Gupta, S Kundu, G Jamieson, ... 2018 IEEE International Interconnect Technology Conference (IITC), 154-156, 2018 | 20 | 2018 |
| Backscattered helium spectroscopy in the helium ion microscope: Principles, resolution and applications R van Gastel, G Hlawacek, S Dutta, B Poelsema Nuclear Instruments and Methods in Physics Research Section B: Beam …, 2014 | 18 | 2014 |
| Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process S Dutta, S Kundu, L Wen, G Jamieson, K Croes, A Gupta, J Bömmels, ... Interconnect Technology Conference (IITC), 2017 IEEE International, 1-3, 2017 | 16 | 2017 |
| The first observation of p-type electromigration failure in full ruthenium interconnects S Beyne, S Dutta, O Varela Pedreira, N Bosman, C Adelmann, I De Wolf, ... 2018 IEEE International Reliability Physics Symposium (IRPS), 2018 | 15 | 2018 |
| Resistivity scaling model for metals with conduction band anisotropy M De Clercq, K Moors, K Sankaran, G Pourtois, S Dutta, C Adelmann, ... Physical Review Materials 2 (3), 033801, 2018 | 13 | 2018 |
| N5 technology node dual-damascene interconnects enabled using multi patterning B Briggs, CJ Wilson, K Devriendt, MH Van Der Veen, S Decoster, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-3, 2017 | 13 | 2017 |
| Characterization of ultra-thin nickel–silicide films synthesized using the solid state reaction of Ni with an underlying Si: P substrate (P: 0.7 to 4.0%) AP Peter, H Yu, S Dutta, E Rosseel, S Van Elshocht, K Paulussen, ... Microelectronic Engineering 157, 52-59, 2016 | 13 | 2016 |
| IEEE International Interconnect Technology Conference (IITC) C Adelmann, K Sankaran, S Dutta, A Gupta, S Kundu, G Jamieson, ... IEEE, 2018 | 12 | 2018 |
| Identification of current transport mechanism in Al2O3 thin films for memory applications S Ramesh, S Dutta, B Shankar, S Gopalan Applied Nanoscience 5, 115-123, 2015 | 9 | 2015 |
| 3ω correction method for eliminating resistance measurement error due to Joule heating B Guralnik, O Hansen, HH Henrichsen, B Beltrán-Pitarch, FW Østerberg, ... Review of Scientific Instruments 92 (9), 2021 | 8 | 2021 |
| Effect of PVD process parameters on the quality and reliability of thin (10–30 nm) Al2O3 dielectrics S Dutta, S Ramesh, B Shankar, S Gopalan Applied Nanoscience 2, 1-6, 2012 | 7 | 2012 |
| Low cost and real time electronic speed controller of position sensorless brushless dc motor PS Dinesh, J Ananthapadmanabha, V Aravind, SN Avinash, S Dutta, ... 2010 Fifth International Conference on Information and Automation for …, 2010 | 7 | 2010 |
| IEEE Electron Device Lett. S Dutta, K Moors, M Vandemaele, C Adelmann IEEE Electron Device Lett 39 (5), 731-734, 2018 | 6 | 2018 |
Christoph AdelmannImecGeverifieerd e-mailadres voor imec.be
