| The thermodynamics of restoring underwater superhydrophobicity PR Jones, AT Kirn, YD Ma, DT Rich, NA Patankar Langmuir 33 (11), 2911-2919, 2017 | 14 | 2017 |
| Controlling phase change: Drying-up under water or staying wet during boiling P Jones, A Kirn, D Rich, A Elliot, N Patankar APS Division of Fluid Dynamics Meeting Abstracts, R35. 011, 2014 | 6 | 2014 |
| Heterogeneous 3D nano-systems: The N3XT approach? D Rich, A Bartolo, C Gilardo, B Le, H Li, R Park, RM Radway, ... NANO-CHIPS 2030: On-Chip AI for an Efficient Data-Driven World, 127-151, 2020 | 5 | 2020 |
| Cooling future system-on-chips with diamond inter-tiers M Malakoutian, A Kasperovich, D Rich, K Woo, C Perez, R Soman, ... Cell Reports Physical Science 4 (12), 2023 | 2 | 2023 |
| EMBER: A 100 MHz, 0.86 mm2, Multiple-Bits-per-Cell RRAM Macro in 40 nm CMOS with Compact Peripherals and 1.0 pJ/bit Read Circuitry LR Upton, A Levy, MD Scott, D Rich, WS Khwa, YD Chih, MF Chang, ... ESSCIRC 2023-IEEE 49th European Solid State Circuits Conference (ESSCIRC …, 2023 | 2 | 2023 |
| Foundry Monolithic 3D BEOL Transistor+ Memory Stack: ISO-Performance and Iso-Footprint BEOL Carbon Nanotube FET+ RRAM vs. FEOL Silicon FET+ RRAM T Srimani, AC Yu, RM Radway, DT Rich, M Nelson, S Wong, D Murphy, ... 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2023 | 2 | 2023 |
| Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits D Rich, A Kasperovich, M Malakoutian, RM Radway, S Hagiwara, ... 2023 60th ACM/IEEE Design Automation Conference (DAC), 1-6, 2023 | 1 | 2023 |
| Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits T Srimani, RM Radway, J Kim, K Prabhu, D Rich, C Gilardi, P Raina, ... 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2023 | 1 | 2023 |
| EMBER: Efficient Multiple-Bits-Per-Cell Embedded RRAM Macro for High-Density Digital Storage A Levy, LR Upton, MD Scott, D Rich, WS Khwa, YD Chih, MF Chang, ... IEEE Journal of Solid-State Circuits, 2024 | | 2024 |
| N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+ Memory Ultra-Dense 3D, 3D Thermal Scaffolding T Srimani, A Bechdolt, S Choi, C Gilardi, A Kasperovich, S Li, Q Lin, ... 2023 International Electron Devices Meeting (IEDM), 1-4, 2023 | | 2023 |
| Testbench on a Chip: A Yield Test Vehicle for Resistive Memory Devices LR Upton, G Lallement, MD Scott, J Taylor, RM Radway, D Rich, ... 2023 24th International Symposium on Quality Electronic Design (ISQED), 1-7, 2023 | | 2023 |
