| Packaging effects on reliability of Cu/low-k interconnects G Wang, C Merrill, JH Zhao, SK Groothuis, PS Ho IEEE Transactions on Device and Materials Reliability 3 (4), 119-128, 2003 | 150 | 2003 |
| Chip-packaging interaction: a critical concern for Cu/low k packaging G Wang, PS Ho, S Groothuis Microelectronics Reliability 45 (7-8), 1079-1093, 2005 | 129 | 2005 |
| Shear stress evaluation of plastic packages D Edwards, K Heinen, S Groothuis, J Martinez IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10 (4 …, 1987 | 122 | 1987 |
| Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods SK Groothuis, J Li, H Zhang, PA Silvestri, X Li, S Luo, LG England, ... US Patent 9,153,520, 2015 | 94 | 2015 |
| Computer aided stress modeling for optimizing plastic package reliability S Groothuis, W Schroen, M Murtuza 23rd International Reliability Physics Symposium, 184-191, 1985 | 94 | 1985 |
| Stress related failures causing open metallization SK Groothuis, WH Schroen 25th International Reliability Physics Symposium, 1-8, 1987 | 67 | 1987 |
| Stacked semiconductor die assemblies with partitioned logic and associated systems and methods J Li, SK Groothuis US Patent App. 14/242,485, 2015 | 41 | 2015 |
| Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths SS Vadhavkar, X Li, SK Groothuis, J Li, JS Gandhi, JM Derderian, ... US Patent 9,691,746, 2017 | 35* | 2017 |
| 3D simulation study of cell-cell interference in advanced NAND flash memory H Liu, S Groothuis, C Mouli, J Li, K Parat, T Krishnamohan 2009 IEEE Workshop on Microelectronics and Electron Devices, 1-3, 2009 | 27 | 2009 |
| Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods SS Vadhavkar, X Li, SK Groothuis, J Li, JS Gandhi, JM Derderian, ... US Patent 9,443,744, 2016 | 23 | 2016 |
| Semiconductor die assembly and methods of forming thermal paths J Li, SK Groothuis US Patent 9,780,079, 2017 | 22 | 2017 |
| Effect of packaging on interfacial cracking in Cu/low k damascene structures G Wang, S Groothuis, PS Ho 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003 | 22 | 2003 |
| Stacked semiconductor die assemblies with thermal spacers and associated systems and methods J Li, SK Groothuis, M Koopmans US Patent 9,287,240, 2016 | 20 | 2016 |
| Numerical simulation of silicon wafer warpage due to thin film residual stresses AH Abdelnaby, GP Potirniche, F Barlow, A Elshabini, S Groothuis, ... 2013 IEEE Workshop on Microelectronics and Electron Devices (WMED), 9-12, 2013 | 18 | 2013 |
| Semiconductor device assembly with vapor chamber SK Groothuis, J Li US Patent 10,215,500, 2019 | 17 | 2019 |
| Semiconductor device packages with improved thermal management and related methods S Groothuis, J Li, S Luo US Patent 9,543,274, 2017 | 17 | 2017 |
| Investigation of residual stress in wafer level interconnect structures induced by wafer processing G Wanga, D Gan, S Groothuis, PS Ho 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 17 | 2006 |
| Parametric investigation of dynamic behavior of FBGA solder joints in board-level drop simulation S Groothuis, C Chen, R Kovacevic Proceedings Electronic Components and Technology, 2005. ECTC'05., 499-503, 2005 | 15 | 2005 |
| Packaging effect on reliability for Cu/low k structures G Wang, S Groothuis, PS Ho 2004 IEEE International Reliability Physics Symposium. Proceedings, 557-562, 2004 | 14 | 2004 |
| Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages S Groothuis, J Li, S Luo US Patent 8,816,494, 2014 | 12 | 2014 |
Gabriel PotirnicheAssociate Professor, University of IdahoVerified email at uidaho.edu
