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Indira Seshadri
Indira Seshadri
IBM Research, Device Patterning Research
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
In situ tensile deformation characterization of human hair with atomic force microscopy
IP Seshadri, B Bhushan
Acta materialia 56 (4), 774-781, 2008
962008
Nanowire-filled polymer composites with ultrahigh thermal conductivity
N Balachander, I Seshadri, RJ Mehta, LS Schadler, T Borca-Tasciuc, ...
Applied Physics Letters 102 (9), 2013
952013
Effect of ethnicity and treatments on in situ tensile response and morphological changes of human hair characterized by atomic force microscopy
IP Seshadri, B Bhushan
Acta materialia 56 (14), 3585-3597, 2008
632008
EUV patterning successes and frontiers
N Felix, D Corliss, K Petrillo, N Saulnier, Y Xu, L Meli, H Tang, A De Silva, ...
Extreme Ultraviolet (EUV) Lithography VII 9776, 480-486, 2016
392016
Microwave synthesis of branched silver nanowires and their use as fillers for high thermal conductivity polymer composites
I Seshadri, GL Esquenazi, T Cardinal, T Borca-Tasciuc, G Ramanath
Nanotechnology 27 (17), 175601, 2016
392016
Multifold increases in thermal conductivity of polymer nanocomposites through microwave welding of metal nanowire fillers
I Seshadri, GL Esquenazi, T Borca-Tasciuc, P Keblinski, G Ramanath
Adv. Mater. Interfaces 2 (15), 1500186, 2015
342015
Vertical-transport nanosheet technology for CMOS scaling beyond lateral-transport devices
H Jagannathan, B Anderson, CW Sohn, G Tsutsui, J Strane, R Xie, S Fan, ...
2021 IEEE International Electron Devices Meeting (IEDM), 26.1. 1-26.1. 4, 2021
292021
Effect of rubbing load on nanoscale charging characteristics of human hair characterized by AFM based Kelvin probe
IP Seshadri, B Bhushan
Journal of colloid and interface science 325 (2), 580-587, 2008
272008
Fundamentals of EUV resist-inorganic hardmask interactions
DL Goldfarb, M Glodde, A De Silva, I Sheshadri, NM Felix, K Lionti, ...
Advances in Patterning Materials and Processes XXXIV 10146, 35-47, 2017
192017
Study of alternate hardmasks for extreme ultraviolet patterning
A De Silva, I Seshadri, A Arceo, K Petrillo, L Meli, B Mendoza, Y Yao, ...
Journal of Vacuum Science & Technology B 34 (6), 2016
172016
Single-expose patterning development for EUV lithography
A De Silva, K Petrillo, L Meli, JC Shearer, G Beique, L Sun, I Seshadri, ...
Extreme Ultraviolet (EUV) Lithography VIII 10143, 311-319, 2017
142017
Nanosheet substrate to source/drain isolation
FL Lie, M Ebrish, EA De Silva, I Seshadri, G Karve, LA Clevenger, ...
US Patent 10,734,523, 2020
122020
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
C Penny, S Gates, B Peethala, J Lee, D Priyadarshini, S Nguyen, ...
2017 IEEE International Interconnect Technology Conference (IITC), 1-4, 2017
122017
Approach to lowering extreme ultraviolet exposure dose for inorganic hardmasks for extreme ultraviolet patterning
EA De Silva, KE Petrillo, IP Seshadri
US Patent 10,082,736, 2018
112018
Integrated dual SPE processes with low contact resistivity for future CMOS technologies
H Wu, SC Seo, C Niu, W Wang, G Tsutsui, O Gluschenkov, Z Liu, ...
2017 IEEE International Electron Devices Meeting (IEDM), 22.3. 1-22.3. 4, 2017
102017
Additive core subtractive liner for metal cut etch processes
R Bao, K Chung, AM Greene, SK Kanakasabapathy, DL Rath, ...
US Patent 10,600,884, 2020
92020
Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer
I Seshadri, A De Silva, L Meli, C Liu, C Chi, J Guo, K Schmidt, H Truang, ...
Extreme Ultraviolet (EUV) Lithography VIII 10143, 290-300, 2017
92017
Softening in silver-nanowire-filled polydimethylsiloxane nanocomposites
I Seshadri, GL Esquenazi, T Borca-Tasciuc, P Keblinski, G Ramanath
Applied Physics Letters 105 (1), 2014
82014
Enabling residue free gap fill between nanosheets
I Seshadri, EA De Silva, J Guo, R Bao, M Sankarapandian, N Felix
US Patent 10,658,521, 2020
72020
Interfacial thermal conductance-rheology nexus in metal-contacted nanocomposites
I Seshadri, T Borca-Tasciuc, P Keblinski, G Ramanath
Applied Physics Letters 103 (17), 2013
72013
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