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Cadmus Yuan
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Nanowire-based gas sensors
X Chen, CKY Wong, CA Yuan, G Zhang
Sensors and Actuators B: Chemical 177, 178-195, 2013
4002013
An overview of solder bump shape prediction algorithms with validations
KN Chiang, CA Yuan
IEEE transactions on advanced packaging 24 (2), 158-162, 2001
1502001
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
X Chen, C Yuan, CKY Wong, G Zhang
Journal of molecular modeling 18, 2333-2341, 2012
842012
An accelerated test method of luminous flux depreciation for LED luminaires and lamps
C Qian, XJ Fan, JJ Fan, CA Yuan, GQ Zhang
Reliability Engineering & System Safety 147, 84-92, 2016
592016
Impact of the functional group on the working range of polyaniline as carbon dioxide sensors
X Chen, CKY Wong, CA Yuan, G Zhang
Sensors and Actuators B: Chemical 175, 15-21, 2012
572012
Product level accelerated lifetime test for indoor LED luminaires
S Koh, C Yuan, B Sun, B Li, X Fan, GQ Zhang
2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013
512013
3D electronic packaging structure having a conductive support substrate
MC Yew, CA Yuan, CY Chou, KN Chiang
US Patent 7,884,464, 2011
462011
Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
X Chen, CA Yuan, CKY Wong, H Ye, SYY Leung, G Zhang
Sensors and Actuators B: Chemical 174, 210-216, 2012
442012
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Y Liu, SYY Leung, J Zhao, CKY Wong, CA Yuan, G Zhang, F Sun, L Luo
Microelectronics Reliability 54 (9-10), 2028-2033, 2014
422014
Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes
H Ye, SW Koh, C Yuan, H van Zeijl, AWJ Gielen, SWR Lee, G Zhang
Applied Thermal Engineering 63 (2), 588-597, 2014
392014
Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline
XP Chen, CA Yuan, CKY Wong, SW Koh, GQ Zhang
Molecular Simulation 37 (12), 990-996, 2011
382011
Design, analysis, and development of novel three-dimensional stacking WLCSP
CA Yuan, CN Han, MC Yew, CY Chou, KN Chiang
IEEE transactions on advanced packaging 28 (3), 387-396, 2005
312005
Miniaturized particulate matter sensor for portable air quality monitoring devices
X Li, E Iervolino, F Santagata, J Wei, CA Yuan, PM Sarro, GQ Zhang
SENSORS, 2014 IEEE, 2151-2154, 2014
302014
Accelerated testing method of LED luminaries
M Cai, DG Yang, S Koh, CA Yuan, WB Chen, BY Wu, GQ Zhang
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012
292012
Chip-on-flexible packaging for high-power flip-chip light-emitting diode by AuSn and SAC soldering
Y Liu, J Zhao, CCA Yuan, GQ Zhang, F Sun
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014
272014
Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials
X Chen, L Shen, CA Yuan, CKY Wong, G Zhang
Sensors and Actuators B: Chemical 177, 856-861, 2013
232013
Chemical–mechanical relationship of amorphous/porous low-dielectric film materials
CA Yuan, O van der Sluis, GQ Zhang, LJ Ernst, WD van Driel, ...
Computational Materials Science 42 (4), 606-613, 2008
232008
Prediction of the bulk elastic constant of metals using atomic-level single-lattice analytical method
KN Chiang, CY Chou, CJ Wu, CA Yuan
Applied physics letters 88 (17), 171904, 2006
222006
Molecular simulation on the material/interfacial strength of the low-dielectric materials
CA Yuan, O van der Sluis, GQK Zhang, LJ Ernst, WD van Driel, ...
Microelectronics Reliability 47 (9-11), 1483-1491, 2007
212007
Mechanical reliability challenges for MEMS packages: Capping
WD van Driel, DG Yang, CA Yuan, M Van Kleef, GQ Zhang
Microelectronics Reliability 47 (9-11), 1823-1826, 2007
202007
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