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Co-authors
- Xingji LiHarbin Institute of TechnologyVerified email at hit.edu.cn
- Hsu-Sheng Tsai (蔡勖升)Harbin Institute of TechnologyVerified email at hit.edu.cn
- Kenneth GallowayVanderbilt UniversityVerified email at vanderbilt.edu
- Daniel M. FleetwoodProfessor of Electrical Engineering, Vanderbilt UniversityVerified email at vanderbilt.edu
- Shengqiang ZhouHelmholtz-Zentrum Dresden-Rossendorf, GermanyVerified email at hzdr.de
- Ron SchrimpfProfessor of Electrical Engineering, Vanderbilt UniversityVerified email at vanderbilt.edu
- Mao WangHelmholtz-Zentrum Dresden-RossendorfVerified email at hzdr.de
- Zhenping WuBeijing University of Posts and TelecommunicationsVerified email at bupt.edu.cn
- Ye YuanSongshan Lake Materials LaboratoryVerified email at sslab.org.cn
- Yufang XieJiangsu universityVerified email at ujs.edu.cn
- Chi XuHelmholtz-Zentrum Dresden-RossendorfVerified email at hzdr.de
- xin zhouUniversity of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
- Lei ShuPerKing UniversityVerified email at hit.edu.cn
- Yonder BerencénHelmholtz-Zentrum Dresden-Rossendorf (HZDR), GermanyVerified email at hzdr.de