Volgen
Tony Wu
Tony Wu
Meta, Inc.
Geverifieerd e-mailadres voor meta.com
Titel
Geciteerd door
Geciteerd door
Jaar
Energy-efficient abundant-data computing: The N3XT 1,000 x
MMS Aly, M Gao, G Hills, CS Lee, G Pitner, MM Shulaker, TF Wu, ...
Computer 48 (12), 24-33, 2015
2722015
Monolithic 3D integration of logic and memory: Carbon nanotube FETs, resistive RAM, and silicon FETs
MM Shulaker, TF Wu, A Pal, L Zhao, Y Nishi, K Saraswat, HSP Wong, ...
2014 IEEE International Electron Devices Meeting, 27.4. 1-27.4. 4, 2014
1872014
Brain-inspired computing exploiting carbon nanotube FETs and resistive RAM: Hyperdimensional computing case study
TF Wu, H Li, PC Huang, A Rahimi, JM Rabaey, HSP Wong, MM Shulaker, ...
2018 IEEE International Solid-State Circuits Conference-(ISSCC), 492-494, 2018
1392018
Hyperdimensional computing with 3D VRRAM in-memory kernels: Device-architecture co-design for energy-efficient, error-resilient language recognition
H Li, TF Wu, A Rahimi, KS Li, M Rusch, CH Lin, JL Hsu, MM Sabry, ...
2016 IEEE International Electron Devices Meeting (IEDM), 16.1. 1-16.1. 4, 2016
1382016
The N3XT Approach to Energy-Efficient Abundant-Data Computing
MMS Aly, TF Wu, A Bartolo, YH Malviya, W Hwang, G Hills, I Markov, ...
Proceedings of the IEEE 107 (1), 19-48, 2018
1202018
TPAD: Hardware Trojan prevention and detection for trusted integrated circuits
TF Wu, K Ganesan, YA Hu, HSP Wong, S Wong, S Mitra
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2015
1032015
Carbon nanotube circuit integration up to sub-20 nm channel lengths
MM Shulaker, J Van Rethy, TF Wu, L Suriyasena Liyanage, H Wei, Z Li, ...
ACS nano 8 (4), 3434-3443, 2014
942014
Monolithic 3D integration: A path from concept to reality
MM Shulaker, TF Wu, MM Sabry, H Wei, HSP Wong, S Mitra
2015 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2015
772015
Resistive RAM-centric computing: Design and modeling methodology
H Li, TF Wu, S Mitra, HSP Wong
IEEE Transactions on Circuits and Systems I: Regular Papers 64 (9), 2263-2273, 2017
732017
Hyperdimensional computing exploiting carbon nanotube FETs, resistive RAM, and their monolithic 3D integration
TF Wu, H Li, PC Huang, A Rahimi, G Hills, B Hodson, W Hwang, ...
IEEE Journal of Solid-State Circuits 53 (11), 3183-3196, 2018
712018
Resistive RAM endurance: Array-level characterization and correction techniques targeting deep learning applications
A Grossi, E Vianello, MM Sabry, M Barlas, L Grenouillet, J Coignus, ...
IEEE Transactions on Electron Devices 66 (3), 1281-1288, 2019
642019
Resistive RAM With Multiple Bits Per Cell: Array-Level Demonstration of 3 Bits Per Cell
BQ Le, A Grossi, E Vianello, T Wu, G Lama, E Beigne, HSP Wong, S Mitra
IEEE Transactions on Electron Devices 66 (1), 641-646, 2018
592018
Cooling three-dimensional integrated circuits using power delivery networks
H Wei, TF Wu, D Sekar, B Cronquist, RF Pease, S Mitra
2012 International Electron Devices Meeting, 14.2. 1-14.2. 4, 2012
532012
High-density multiple bits-per-cell 1T4R RRAM array with gradual SET/RESET and its effectiveness for deep learning
ER Hsieh, M Giordano, B Hodson, A Levy, SK Osekowsky, RM Radway, ...
2019 IEEE International Electron Devices Meeting (IEDM), 35.6. 1-35.6. 4, 2019
482019
Efficient metallic carbon nanotube removal for highly-scaled technologies
MM Shulaker, G Hills, TF Wu, Z Bao, HSP Wong, S Mitra
2015 IEEE International Electron Devices Meeting (IEDM), 32.4. 1-32.4. 4, 2015
442015
RADAR: A fast and energy-efficient programming technique for multiple bits-per-cell RRAM arrays
BQ Le, A Levy, TF Wu, RM Radway, ER Hsieh, X Zheng, M Nelson, ...
IEEE Transactions on Electron Devices 68 (9), 4397-4403, 2021
332021
Monolithic 3D integration advances and challenges: From technology to system levels
MS Ebrahimi, G Hills, MM Sabry, MM Shulaker, H Wei, TF Wu, S Mitra, ...
2014 SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S …, 2014
292014
System-level design and integration of a prototype ar/vr hardware featuring a custom low-power dnn accelerator chip in 7nm technology for codec avatars
HE Sumbul, TF Wu, Y Li, SS Sarwar, W Koven, E Murphy-Trotzky, X Cai, ...
2022 IEEE Custom Integrated Circuits Conference (CICC), 01-08, 2022
232022
14.3 A 43pJ/cycle non-volatile microcontroller with 4.7 μs shutdown/wake-up integrating 2.3-bit/cell resistive RAM and resilience techniques
TF Wu, BQ Le, R Radway, A Bartolo, W Hwang, S Jeong, H Li, P Tandon, ...
2019 IEEE International Solid-State Circuits Conference-(ISSCC), 226-228, 2019
222019
3D nanosystems enable embedded abundant-data computing: special session paper
W Hwang, MMS Aly, YH Malviya, M Gao, TF Wu, C Kozyrakis, HSP Wong, ...
Proceedings of the Twelfth IEEE/ACM/IFIP International Conference on …, 2017
17*2017
Het systeem kan de bewerking nu niet uitvoeren. Probeer het later opnieuw.
Artikelen 1–20