Zhiheng Huang
Zhiheng Huang
Sun Yat-sen University, Loughborough University, Harbin Institute of Technology
Geverifieerd e-mailadres voor mail.sysu.edu.cn
Geciteerd door
Geciteerd door
A selective laser melting and solution heat treatment refined Al–12Si alloy with a controllable ultrafine eutectic microstructure and 25% tensile ductility
XP Li, XJ Wang, M Saunders, A Suvorova, LC Zhang, YJ Liu, MH Fang, ...
Acta Materialia 95, 74-82, 2015
Reliability issues in Pb-free solder joint miniaturization
Z Huang, PP Conway, E Jung, RC Thomson, C Liu, T Loeher, M Minkus
Journal of electronic materials 35 (9), 1761-1772, 2006
A new sintering additive for silicon carbide ceramic
ZH Huang, DC Jia, Y Zhou, YG Liu
Ceramics International 29 (1), 13-17, 2003
A computational interface for thermodynamic calculations software MTDATA
Z Huang, PP Conway, RC Thomson, AT Dinsdale, JAJ Robinson
Calphad 32 (1), 129-134, 2008
Microstructural considerations for ultrafine lead free solder joints
Z Huang, PP Conway, RC Thomson
Microelectronics Reliability 47 (12), 1997-2006, 2007
Effect of a new additive on mechanical properties of hot-pressed silicon carbide ceramics
ZH Huang, DC Jia, Y Zhou, YJ Wang
Materials research bulletin 37 (5), 933-940, 2002
Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behavior
Z Wu, Z Huang, Y Ma, H Xiong, PP Conway
Electronic Materials Letters 10 (1), 281-292, 2014
Effect of solder bump geometry on the microstructure of Sn–3.5 wt% Ag on electroless nickel immersion gold during solder dipping
Z Huang, PP Conway, C Liu, RC Thomson
Journal of materials research 20 (3), 649-658, 2005
Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys
C Liu, Z Huang, PP Conway, RC Thomson
Journal of materials science 42 (11), 4076-4086, 2007
The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints
Z Huang, PP Conway, C Liu, RC Thomson
Journal of electronic materials 33 (10), 1227-1235, 2004
A generalized computational interface for combined thermodynamic and kinetic modeling
H Xiong, Z Huang, Z Wu, PP Conway
Calphad 35 (3), 391-395, 2011
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnections
Z Huang, PP Conway, R Qin
Microsystem technologies 15 (1), 101-107, 2009
Investigation on a magnesiothermic reduction process for preparation of nanocrystalline silicon thin film
B Ma, Z Huang, L Mei, M Fang, Y Liu, X Wu
Surface Engineering 32 (10), 761-765, 2016
Effects of stress and electromigration on microstructural evolution in microbumps of three-dimensional integrated circuits
H Xiong, Z Huang, P Conway
IEEE Transactions on Device and Materials Reliability 14 (4), 995-1004, 2014
Preparation of LiTaO3 nanoparticles by a sol–gel route
YG Liu, JH Hu, ZH Huang, MH Fang
Journal of sol-gel science and technology 58 (3), 664-668, 2011
Mechanisms of copper protrusion in through-silicon-via structures at the nanoscale
J Liu, Z Huang, Y Zhang, PP Conway
Japanese Journal of Applied Physics 58 (1), 016502, 2018
In situ TEM observation of crack propagation in LiTaO3 particle toughened Al2O3 ceramics
YG Liu, DC Jia, Y Zhou, MH Fang, ZH Huang
Ceramics International 37 (2), 647-650, 2011
Characterisation of intermetallics and mechanical behaviour in the reaction between SnAgCu and Sn-Pb solder alloys
Z Huang, C Liu, P Conway, R Thomson
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004
An integrated materials modeling platform for electronic packaging
Z Huang, P Conway, H Davies, A Dinsdale, Z Wu, B Wang
The 12th International Conference on Electronics Materials and Packaging, 60-66, 2010
Fabrication and properties of calcium-hexaluminate/magnesium-aluminium spinel composites
YG Liu, LX Wei, MH Fang, XY Ji, ZH Huang
J Chin Ceram Soc 38 (10), 1944-1947, 2010
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