Ketan Shringarpure
Ketan Shringarpure
Google, Missouri S&T
Verified email at google.com
Title
Cited by
Cited by
Year
Equivalent circuit model for power bus design in multi-layer PCBs with via arrays
J Kim, K Shringarpure, J Fan, J Kim, JL Drewniak
IEEE Microwave and Wireless Components Letters 21 (2), 62-64, 2011
432011
Formulation and network model reduction for analysis of the power distribution network in a production-level multilayered printed circuit board
K Shringarpure, S Pan, J Kim, J Fan, B Achkir, B Archambeault, ...
IEEE Transactions on Electromagnetic Compatibility 58 (3), 849-858, 2016
33*2016
Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer
J Kim, S De, K Shringarpure, S Pan, B Achkir, J Fan, JL Drewniak
2011 IEEE International Symposium on Electromagnetic Compatibility, 422-427, 2011
302011
Characterization of PCB dielectric properties using two striplines on the same board
L Hua, B Chen, S Jin, M Koledintseva, J Lim, K Qiu, R Brooks, J Zhang, ...
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
262014
On finding the optimal number of decoupling capacitors by minimizing the equivalent inductance of the PCB PDN
K Shringarpure, B Zhao, L Wei, B Archambeault, A Ruehli, M Cracraft, ...
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
242014
Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN
B Zhao, C Huang, K Shringarpure, J Fan, B Archambeault, B Achkir, ...
2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity …, 2015
192015
Plane-pair PEEC model for power distribution networks with sub-meshing techniques
L Wei, L Li, K Shringarpure, AE Ruehli, E Wheeler, J Fan, B Archambeault, ...
IEEE Transactions on Microwave Theory and Techniques 64 (3), 733-741, 2016
162016
Sensitivity analysis of a circuit model for power distribution network in a multilayered printed circuit board
K Shringarpure, S Pan, J Kim, J Fan, B Achkir, B Archambeault, ...
IEEE Transactions on Electromagnetic Compatibility 59 (6), 1993-2001, 2017
142017
Plane-pair PEEC models for PDN using sub-meshing
L Wei, K Shringarpure, A Ruehli, E Wheeler, J Drewniak
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014
102014
Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects
X Gu, F De Paulis, R Rimolo-Donadio, K Shringarpure, Y Zhang, ...
Proceedings IEC DesignCon 2009, 2009
102009
Transient simulation for power integrity using physics based circuit modeling
B Zhao, C Huang, K Shringarpure, S Bai, T Makharashvili, YS Cao, ...
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2016
92016
De-embedding techniques for transmission lines: An exploration, review, and proposal
N Erickson, K Shringarpure, J Fan, B Achkir, S Pan, C Hwang
2013 IEEE International Symposium on Electromagnetic Compatibility, 840-845, 2013
92013
Innovative PDN design guidelines for practical high layer-count PCBs
K Shringarpure, S Pan, J Kim, B Achkir, B Archambeault, J Fan, ...
UBM Electronics 2, 1290, 2013
92013
Power integrity with voltage ripple spectrum decomposition for physics-based design
C Huang, B Zhao, K Shringarpure, S Bai, X Fang, T Makharashvili, H Ye, ...
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
82016
Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer
Q Wang, K Shringarpure, B Chen, J Fan, C Hwang, S Pan, B Achkir
2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging …, 2014
82014
Effect of narrow power fills on PCB PDN noise
K Shringarpure, B Zhao, B Archambeault, A Ruehli, J Fan, J Drewniak
2014 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2014
82014
The study of a model for via transition and the multi-layer via transition tool GUI design
K Shringarpure
Missouri University of Science and Technology, 2010
62010
Designing test patterns for effective measurement of typical TSV pairs in a silicon interposer
Q Wang, K Shringarpure, J Fan, C Hwang, S Pan, B Achkir
2014 International Symposium on Electromagnetic Compatibility, Tokyo, 382-385, 2014
42014
Printed circuit board power distribution network modeling, analysis and design, and, statistical crosstalk analysis for high speed digital links
K Shringarpure
Missouri University of Science and Technology, 2015
32015
Plane-Pair PEEC Model for Power Distribution Networks with Sub-Meshing Techniques
E Wheeler, L Wei, L Li, K Shringarpure, A Ruehli, J Fan, B Archambeault, ...
2016
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