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Co-authors
- Danijela Cabric, IEEE FellowUniversity of California, Los AngelesVerified email at ee.ucla.edu
- Mohamed IbnkahlaCarleton University, Ottawa, CanadaVerified email at carleton.ca
- Amitava (Amitabha) GhoshNokia Fellow and Head, Radio Interface Group, Nokia Bell LabsVerified email at nokia.com
- Waleed EjazLakehead University, CanadaVerified email at ieee.org
- Ohtsuki TomoakiKeio UniversityVerified email at ics.keio.ac.jp
- Fereidoun H. PanahiAssistant Professor, University of Kurdistan, SanandajVerified email at uok.ac.ir
- Farzad H. PanahiUniversity of KurdistanVerified email at uok.ac.ir
- Mohamed SialaProfesseur, Sup'ComVerified email at supcom.tn
- Fatma AbdelkefiSup'Com, TunisiaVerified email at supcom.tn
- Mohamed El-TarhuniAmerican University of Sharjah, UAEVerified email at aus.edu
- Nasser QaddoumiAmerican University of SharjahVerified email at aus.edu
- Petar PopovskiProfessor, Connectivity, Aalborg University, DenmarkVerified email at es.aau.dk
- Amr El MougyAssociate Professor, Faculty of Media Engineering and Technology, German University in CairoVerified email at guc.edu.eg
- Nesrine CherifPhDVerified email at uottawa.ca
- Louay JalloulQualcomm Inc.Verified email at ieee.org
- Mihir LaghateQualcommVerified email at ucla.edu
- Sofie PollinProfessor Electrical Engineering, KU LeuvenVerified email at esat.kuleuven.be
- Tom VermeulenPhD Researcher, KU LeuvenVerified email at esat.kuleuven.be
- Falko DresslerTechnische Universität BerlinVerified email at ccs-labs.org
- Seyhan UcarPrincipal Research Scientist at InfoTech Labs TMNA R&DVerified email at toyota.com