Volgen
Swarnakamal Priyabadini
Swarnakamal Priyabadini
PhD Student at Cmst, Ghent University, Belgium
Geverifieerd e-mailadres voor elis.ugent.be - Homepage
Titel
Geciteerd door
Geciteerd door
Jaar
High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packages
S Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J Vanfleteren
IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013
172013
3-D stacking of ultrathin chip packages: An innovative packaging and interconnection technology
S Priyabadini, T Sterken, L Van Hoorebeke, J Vanfleteren
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013
122013
High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based Ultra-Thin Chip package (UTCP)
T Sterken, M Op de Beeck, F Vermeiren, T Torfs, L Wang, S Priyabadini, ...
International Symposium on Microelectronics 2012 (1), 000940-000945, 2012
82012
Module miniaturization by ultra thin package stacking
T Löher, D Schütze, A Ostmann, R Aschenbrenner
2010 IEEE CPMT Symposium Japan, 1-4, 2010
72010
An approach to produce a stack of photo definable polyimide based flat UTCPs
S Priyabadini, T Sterken, L Wang, K Dhaenens, B Vandecasteele, ...
2012 4th Electronic System-Integration Technology Conference, 1-4, 2012
62012
3D-stacking of ultra-thin chips and chip packages
S Priyabadini
Ghent University, 2013
22013
Photo-definable polyimide-based flat UTCP technology for 3D-stacking application
S Priyabadini, T Sterken, M Op de Beeck, J Vanfleteren
Smart Systems Integration 2013, 2013
22013
3D-stacking of UTCPs as a module miniaturization technology
S Priyabadini, A Gielen, K Dhaenens, W Christiaens, S Van Put, G Kunkel, ...
International Symposium on Microelectronics 2011 (1), 000463-000468, 2011
22011
Low-resistive sulphur-treated ohmic contacts to n-type InAsSb
S Arafin, A Bachmann, K Kashani-Shirazi, S Priyabadini, MC Amann
IET optoelectronics 3 (6), 259-263, 2009
22009
Low-resistive ohmic contacts to n-InAs0. 91Sb0. 09 for GaSb-based VCSELs in the mid-infrared range
S Arafin, A Bachmann, K Kashani-Shirazi, S Priyabadini, MC Amann
Semiconductor and integrated optoelectronic conference, Cardiff, 2009
22009
3D-stacking of UTCPs as a module miniaturisation
S Priyabadini, A Gielen, K Dhaenens, W Christiaens, S Van Put, G Kunkel, ...
2011
Het systeem kan de bewerking nu niet uitvoeren. Probeer het later opnieuw.
Artikelen 1–11