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Co-authors
An LiuCollege of Information Science and Electronic Engineering, Zhejiang UniversityVerified email at zju.edu.cn- Ricky Yu-Kwong KwokHong Kong Metropolitan UniversityVerified email at hkmu.edu.hk
- Roger S ChengHKUSTVerified email at ust.hk
- Ross MurchChair Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
- Kaibin HuangAssociate Professor, Dept. of EEE, The University of Hong Kong; IEEE FellowVerified email at eee.hku.hk
- Wai Ho MOWHong Kong University of Science and Technology (HKUST)Verified email at ust.hk
- Shunqing ZhangProfessor, SHU; Previous in Intel & HuaweiVerified email at shu.edu.cn
- Youjian (Eugene) LiuUniversity of Colorado at BoulderVerified email at colorado.edu
- Rui WangAssociate Professor, The Southern University of Science & TechnologyVerified email at sustech.edu.cn
- Xiongbin RAOHong Kong University of Science and TechnologyVerified email at ust.hk
- Ying CuiShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
- Chi Ying TsuiHong Kong University of Science and TechnologyVerified email at ece.ust.hk
- Edward AuDistinguished Engineer, Huawei TechnologiesVerified email at huawei.com
- ZHANG Fan (Michael)Huawei TechnologiesVerified email at huawei.com
- Junting ChenAssistant Professor in School of Science and Engineering, Chinese University of Hong Kong, ShenzhenVerified email at cuhk.edu.cn
- Wei WangZhejiang UniversityVerified email at zju.edu.cn
- Mugen PengBeijing University of Posts & Telecommun., IEEE Fellow, Web of Science Highly Cited ResearcherVerified email at bupt.edu.cn
- Yan ChenHuawei TechnologiesVerified email at huawei.com
- Danny TsangProfessor of ECE, HKUSTVerified email at ece.ust.hk
- Robert HeathLampe Distinguished Professor, North Carolina State UniversityVerified email at ncsu.edu
