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Co-authors
An LiuCollege of Information Science and Electronic Engineering, Zhejiang UniversityVerified email at zju.edu.cn
Ricky Yu-Kwong KwokVice President (Students and Support), OUHKVerified email at ouhk.edu.hk
Roger S ChengHKUSTVerified email at ust.hk
Ross MurchChair Professor, Hong Kong University of Science and TechnologyVerified email at ust.hk
Kaibin HuangAssociate Professor, Dept. of EEE, The University of Hong Kong; IEEE FellowVerified email at eee.hku.hk
Wai Ho MOWHong Kong University of Science and Technology (HKUST)Verified email at ust.hk
Shunqing ZhangProfessor, SHU; Previous in Intel & HuaweiVerified email at shu.edu.cn
Youjian (Eugene) LiuUniversity of Colorado at BoulderVerified email at colorado.edu
Xiongbin RAOHong Kong University of Science and TechnologyVerified email at ust.hk
Rui WangAssociate Professor, The Southern University of Science & TechnologyVerified email at sustech.edu.cn
Ying CuiShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Chi Ying TsuiHong Kong University of Science and TechnologyVerified email at ece.ust.hk
Edward AuPrincipal Engineer, Huawei TechnologiesVerified email at huawei.com
ZHANG Fan (Michael)Huawei TechnologiesVerified email at huawei.com
Junting ChenAssistant Professor in School of Science and Engineering, Chinese University of Hong Kong, ShenzhenVerified email at cuhk.edu.cn
Wei WangZhejiang UniversityVerified email at zju.edu.cn
Yan ChenHuawei TechnologiesVerified email at huawei.com
Mugen PengBeijing University of Posts & Telecommun., IEEE Fellow, Web of Science Highly Cited ResearcherVerified email at bupt.edu.cn
Danny TsangProfessor of ECE, HKUSTVerified email at ece.ust.hk
Robert HeathDistinguished Professor, North Carolina State UniversityVerified email at ncsu.edu