| A prototype PZT matrix transducer with low-power integrated receive ASIC for 3-D transesophageal echocardiography C Chen, SB Raghunathan, Z Yu, M Shabanimotlagh, Z Chen, Z Chang, ... IEEE transactions on ultrasonics, ferroelectrics, and frequency control 63 …, 2015 | 77 | 2015 |
| Hybrid Systems in Foil (HySiF) exploiting ultra-thin flexible chips C Harendt, J Kostelnik, A Kugler, E Lorenz, S Saller, A Schreivogel, Z Yu, ... Solid-State Electronics 113, 101-108, 2015 | 59 | 2015 |
| Design of a micro-beamformer for a 2D piezoelectric ultrasound transducer S Blaak, Z Yu, GCM Meijer, C Prins, CT Lancee, JG Bosch, N de Jong 2009 IEEE International Ultrasonics Symposium, 1338-1341, 2009 | 56 | 2009 |
| Front-end receiver electronics for a matrix transducer for 3-D transesophageal echocardiography Z Yu, S Blaak, ZY Chang, J Yao, JG Bosch, C Prins, CT Lancée, ... IEEE transactions on ultrasonics, ferroelectrics, and frequency control 59 …, 2012 | 50 | 2012 |
| Ultra‐thin smart electronic skin based on hybrid system‐in‐foil concept combining three flexible electronics technologies M Elsobky, Y Mahsereci, Z Yu, H Richter, JN Burghartz, J Keck, H Klauk, ... Electronics Letters 54 (6), 338-340, 2018 | 28 | 2018 |
| Ultrasound beamformer using pipeline-operated S/H delay stages and charge-mode summation Z Yu, MAP Pertijs, GCM Meijer Electronics letters 47 (18), 1011-1012, 2011 | 22 | 2011 |
| A programmable analog delay line for Micro-beamforming in a transesophageal ultrasound probe Z Yu, MAP Pertijs, GCM Meijer 2010 10th IEEE international conference on solid-state and integrated …, 2010 | 22 | 2010 |
| Hybrid systems-in-foil—combining the merits of thin chips and of large-area electronics JN Burghartz, G Alavi, B Albrecht, T Deuble, M Elsobky, S Ferwana, ... IEEE Journal of the Electron Devices Society 7, 776-783, 2019 | 21 | 2019 |
| Ultra-thin silicon chips in flexible microsystems J Wolf, J Kostelnik, K Berschauer, A Kugler, E Lorenz, C Harendt, Z Yu Proceedings of the ECWC 13, 2014 | 17 | 2014 |
| Backside illuminated “Ge-on-Si” NIR camera M Oehme, M Kaschel, S Epple, M Wanitzek, Z Yu, D Schwarz, AC Köllner, ... IEEE Sensors Journal 21 (17), 18696-18705, 2021 | 13 | 2021 |
| Thermal characterization and modeling of ultra-thin silicon chips M Alshahed, Z Yu, H Rempp, H Richter, C Harendt, JN Burghartz Solid-State Electronics 113, 121-126, 2015 | 12 | 2015 |
| Measurement-based compact thermal model extraction methodology for packaged ICs MS Alshahed, Z Yu, H Richter, C Harendt, JN Burghartz IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 11 | 2017 |
| Method of manufacturing an ultrasound transducer and devices including an ultrasound transducer C Prins, JA Ponte, Z Yu US Patent 9,237,879, 2016 | 11 | 2016 |
| Design of a low power time-gain-compensation amplifier for a 2D piezoelectric ultrasound transducer J Yao, Z Yu, MAP Pertijs, GCM Meijer, CT Lancée, JG Bosch, N de Jong 2010 IEEE International Ultrasonics Symposium, 841-844, 2010 | 9 | 2010 |
| Realization and opto-electronic characterization of linear self-reset pixel cells for a high dynamic CMOS image sensor S Hirsch, M Strobel, W Klingler, JD Schulze Spüntrup, Z Yu, JN Burghartz Advances in Radio Science 17, 239-247, 2019 | 8 | 2019 |
| Ultra-thin sensor systems integrating silicon chips with on-foil passive and active components M Elsobky, G Alavi, B Albrecht, T Deuble, C Harendt, H Richter, Z Yu, ... Proceedings 2 (13), 748, 2018 | 7 | 2018 |
| A new MOSFET model for the simulation of circuits under mechanical stress H Alius, H Rempp, Z Yu, T Gneiting Proc. MOS-AK Workshop, 2014 | 7 | 2014 |
| A new CMOS stress sensor ratiometric readout for in-plane stress magnitude and angle detection Z Yu, C Scherjon, Y Mahsereci, JN Burghartz 2017 IEEE SENSORS, 1-3, 2017 | 6 | 2017 |
| Characterization of thin-film temperature sensors and ultra-thin chips for HySiF integration M Elsobky, A Ottaviani, M Alomari, Z Yu, T Deuble, JN Burghartz 2019 IEEE international conference on flexible and printable sensors and …, 2019 | 5 | 2019 |
| A lithium-ion battery demonstrator for HEV applications featuring a smart system at cell level F Saidani, FX Hutter, W Selinger, Z Yu, JN Burghartz 2017 IEEE International Systems Engineering Symposium (ISSE), 1-5, 2017 | 5 | 2017 |
