| Precipitation hardening of anAl–4.2 wt% Mg–0.6 wt% Cu alloy P Ratchev, B Verlinden, P De Smet, P Van Houtte Acta materialia 46 (10), 3523-3533, 1998 | 215 | 1998 |
| Hermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages B Vandevelde, M Gonzalez, P Limaye, P Ratchev, E Beyne 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 166 | 2004 |
| Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads P Ratchev, S Stoukatch, B Swinnen Microelectronics Reliability 46 (8), 1315-1325, 2006 | 106 | 2006 |
| Effect of preheat temperature on the orientation relationship of (Mn, Fe) Al6 precipitates in an AA 5182 Aluminium—Magnesium alloy P Ratchev, B Verlinden, P Van Houtte Acta metallurgica et materialia 43 (2), 621-629, 1995 | 101 | 1995 |
| A comparative study of two Al-Mg-Si alloys for automotive applications T Moons, P Ratchev, B Verlinden, P Van Houtte, P De Smet Scripta materialia 35 (8), 1996 | 98 | 1996 |
| Study of the temperature dependence of the bainitic transformation rate in a multiphase TRIP-assisted steel E Girault, P Jacques, P Ratchev, J Van Humbeeck, B Verlinden, ... Materials Science and Engineering: A 273, 471-474, 1999 | 88 | 1999 |
| Reliability and failure analysis of Sn-Ag-Cu solder interconnections for PSGA packages on Ni/Au surface finish P Ratchev, B Vandevelde, I De Wolf IEEE Transactions on Device and Materials Reliability 4 (1), 5-10, 2004 | 75 | 2004 |
| Mechanical issues of Cu-to-Cu wire bonding J Chen, D Degryse, P Ratchev, I De Wolf IEEE transactions on components and packaging technologies 27 (3), 539-545, 2004 | 64 | 2004 |
| Creep as a reliability problem in MEMS R Modlinski, A Witvrouw, P Ratchev, A Jourdain, V Simons, HAC Tilmans, ... Microelectronics Reliability 44 (9-11), 1733-1738, 2004 | 59 | 2004 |
| Artificial ageing of Al–Mg–Cu alloys P Ratchev, B Verlinden, P De Smet, P Van Houtte Materials Transactions, JIM 40 (1), 34-41, 1999 | 55 | 1999 |
| Direct gold and copper wires bonding on copper HM Ho, W Lam, S Stoukatch, P Ratchev, CJ Vath III, E Beyne Microelectronics Reliability 43 (6), 913-923, 2003 | 52 | 2003 |
| Creep characterization of Al alloy thin films for use in MEMS applications R Modlinski, A Witvrouw, P Ratchev, R Puers, JMJ den Toonder, I De Wolf Microelectronic engineering 76 (1-4), 272-278, 2004 | 51 | 2004 |
| Creep-resistant aluminum alloys for use in MEMS R Modlinski, P Ratchev, A Witvrouw, R Puers, I De Wolf Journal of Micromechanics and Microengineering 15 (7), S165, 2005 | 47 | 2005 |
| Hot working of AA1050—relating the microstructural and textural developments I Samajdar, P Ratchev, B Verlinden, E Aernoudt Acta materialia 49 (10), 1759-1769, 2001 | 44 | 2001 |
| Effect of cooling rate and predeformation on the precipitation hardening of an Al-4.2 wt.% Mg-0.6 wt.% Cu alloy P Ratchev, B Verlinden, P De Smet, P Van Houtte Scripta materialia 38 (8), 1195-1201, 1998 | 44 | 1998 |
| On the formation of 2H stacking sequence in 18R martensite plates in a precipitate containing Cu Al Ni Ti Mn alloy P Ratchev, J Van Humbeeck, L Delaey Acta metallurgica et materialia 41 (8), 2441-2449, 1993 | 42 | 1993 |
| A fundamental study of the χ-phase precipitation in CuAlNiTi (Mn) shape memory alloys I Hurtado, P Ratchev, J Van Humbeeck, L Delaey Acta materialia 44 (8), 3299-3306, 1996 | 38 | 1996 |
| Preparation and properties ofX-sialon Y Zhou, J Vleugels, T Laoui, P Ratchev, O Van der Biest Journal of Materials science 30, 4584-4590, 1995 | 37 | 1995 |
| S [prime] phase precipitation in Al-4wt.% Mg-1wt.% Cu alloy P Ratchev, B Verlinden, P Van Houtte Scripta Metallurgica et Materialia;(United States) 30 (5), 1994 | 31 | 1994 |
| Brittle to ductile fracture transition in bulk Pb-free solders P Ratchev, B Vandevelde, B Verlinden, B Allaert, D Werkhoven IEEE Transactions on Components and Packaging Technologies 30 (3), 416-423, 2007 | 29 | 2007 |
