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Jean-Pierre RaskinUniversité catholique de Louvain, Engineering School of LouvainVerified email at uclouvain.be
Joan RedwingPenn State UniversityVerified email at psu.edu
Saiphaneendra BachuSamsung Austin SemiconductorVerified email at psu.edu
Tanushree H. ChoudhuryIndian Institute of Technology Bombay, PowaiVerified email at iitb.ac.in
Thomas PardoenUCLouvain, Institute of Mechanics, Materials and Civil Engineering (iMMC)Verified email at uclouvain.be
Anushka BansalProcess Engineer, IntelVerified email at psu.edu
Farzaneh BahramiIMEC, Leuven, BelgiumVerified email at imec.be
Denis FlandreICTEAM, EPL, Université catholique de Louvain (UCL)Verified email at uclouvain.be
Xiaotian ZhangSJTUVerified email at sjtu.edu.cn
Azim KozhakhmetovIntel CorporationVerified email at intel.com
Maria HilseThe Pennsylvania State UniversityVerified email at psu.edu
Jean-Joseph AdjizianInstitute of Condensed Matter and Nanosciences (IMCN), UCLouvainVerified email at uclouvain.be
Jean-Christophe CharlierProfessor of PhysicsVerified email at uclouvain.be
Shanthi Iyer alias E.ShanthiProfessor, Nanoengineering, Joint School of Nanoscience and NanoengineeringVerified email at ncat.edu
Surya NalamatiIntel CorporationVerified email at intel.com
Laurent A. FRANCISUniversité catholique de Louvain, ICTEAM Institute, Ecole Polytechnique de LouvainVerified email at uclouvain.be
Nicolas ANDREICTEAM, EPL, Université catholique de LouvainVerified email at uclouvain.be
Guoli LiAssociate Professor at Hunan University, PhD from Université catholique de LouvainVerified email at hnu.edu.cn
Thibault DelhayeICTEAM, EPL, Université catholique de LouvainVerified email at uclouvain.be
Gwo-Ching WangRensselaer Polytechnic InstituteVerified email at rpi.edu