| Tunneling contact IGZO TFTs with reduced saturation voltages L Wang, Y Sun, X Zhang, L Zhang, S Zhang, M Chan Applied Physics Letters 110 (15), 2017 | 34 | 2017 |
| Measurement methodologies for acoustic noise induced by multilayer ceramic capacitors of power distribution network in mobile systems Y Sun, S Wu, J Zhang, C Hwang, Z Yang IEEE Transactions on Electromagnetic Compatibility 62 (4), 1515-1523, 2020 | 20 | 2020 |
| Jitter-aware economic pdn optimization with a genetic algorithm Z Xu, Z Wang, Y Sun, C Hwang, H Delingette, J Fan IEEE Transactions on Microwave Theory and Techniques 69 (8), 3715-3725, 2021 | 16 | 2021 |
| Simulation methodologies for acoustic noise induced by multilayer ceramic capacitors of power distribution network in mobile systems Y Sun, S Wu, J Zhang, C Hwang, Z Yang IEEE Transactions on Electromagnetic Compatibility 63 (2), 589-597, 2020 | 15 | 2020 |
| Mechanism and validation of USB 3.0 connector caused radio frequency interference Y Sun, H Lin, BC Tseng, D Pommerenke, C Hwang IEEE Transactions on Electromagnetic Compatibility 62 (4), 1169-1178, 2019 | 15 | 2019 |
| RFI noise source quantification based on reciprocity Y Sun, BC Tseng, H Lin, C Hwang 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 15 | 2018 |
| Jitter-aware target impedance Y Sun, J Kim, C Hwang 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 14 | 2019 |
| Characterization of interface trap dynamics responsible for hysteresis in organic thin-film transistors Y Sun, L Zhang, Z Ahmed, M Chan Organic Electronics 27, 192-196, 2015 | 14 | 2015 |
| Analyzing multiple vias in a parallel-plate pair based on a nonorthogonal PEEC method X Sun, T Huang, L Ye, Y Sun, S Jin, J Fan IEEE Transactions on Electromagnetic Compatibility 61 (5), 1602-1611, 2018 | 12 | 2018 |
| Measurement investigation on acoustic noise caused by “singing” capacitors on mobile devices Y Sun, J Zhang, Z Yang, C Hwang, S Wu 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 11 | 2019 |
| Causality analyzing for transmission line with surface roughness X Sun, Y Guo, Y Sun, K Song, L Ye, X Ye, JL Drewniak, J Fan 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 11 | 2019 |
| A generalized power supply induced jitter model based on power supply rejection ratio response Y Sun, J Lee, C Hwang IEEE Transactions on Very Large Scale Integration (VLSI) Systems 29 (6 …, 2021 | 9 | 2021 |
| Improved target impedance concept with jitter specification Y Sun, J Kim, M Ouyang, C Hwang IEEE Transactions on Electromagnetic Compatibility 62 (4), 1534-1545, 2020 | 9 | 2020 |
| Modeling stripline with slotted ground plane in multilayered circuit board using PEEC formulation L Ye, X Sun, T Huang, Y Sun, S Jin, B Chen, J Fan IEEE Transactions on Electromagnetic Compatibility 62 (1), 280-284, 2019 | 9 | 2019 |
| Mechanism analysis on radio frequency radiation in IC/package with bonding wires M Ouyang, Y Sun, J Lee, J Kim, C Hwang 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 7 | 2020 |
| An efficient approach to find the truncation frequency for transmission line-based dielectric material property extraction X Sun, L Ye, K Song, Y Sun, S Jin, B Chen, M Tsiklauri, X Ye, J Fan 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 7 | 2018 |
| Decoupling capacitor layout design guidelines for acoustic noise consideration in power distribution network Y Sun, S Wu, J Zhang, C Hwang, Z Yang 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 6 | 2020 |
| Simulation Investigation on Acoustic Noise Caused by “Singing” Capacitors on Mobile Devices Y Sun, J Zhang, Z Yang, C Hwang, S Wu 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 6 | 2019 |
| Modeling of power supply noise associated with package parasitics in an on-chip ldo regulator J Joo, Y Sun, J Lee, S Kong, S Kang, I Song, C Hwang 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 395-399, 2021 | 5 | 2021 |
| Improving power supply induced jitter simulation accuracy for IBIS model Y Sun, C Hwang 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 1127-1132, 2021 | 3 | 2021 |
Chulsoon HwangMissouri University of Science and TechnologyVerified email at mst.edu
