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Robert Keller
Robert Keller
Materials Research Engineer, NIST
Verified email at nist.gov - Homepage
Title
Cited by
Cited by
Year
Transmission EBSD from 10 nm domains in a scanning electron microscope
RR Keller, RH Geiss
Journal of Microscopy 245 (3), 245-251, 2012
4722012
Tensile properties of free-standing aluminum thin films
DT Read, YW Cheng, RR Keller, JD McColskey
Scripta Materialia 45 (5), 583-589, 2001
1192001
Tensile and fracture behavior of free-standing copper films
RR Keller, JM Phelps, DT Read
Materials Science and Engineering: A 214 (1-2), 42-52, 1996
1141996
Thermal fatigue testing of thin metal films
R Mönig, RR Keller, CA Volkert
Review of Scientific Instruments 75 (11), 4997-5004, 2004
1112004
EBSD measurement of strains in GaAs due to oxidation of buried AlGaAs layers
RR Keller, A Roshko, RH Geiss, KA Bertness, TP Quinn
Microelectronic engineering 75 (1), 96-102, 2004
942004
Characterization of interfacial dislocation networks in a creep-deformed nickel-base superalloy
RR Keller, HJ Maier, H Mughrabi
Scripta metallurgica et materialia 28 (1), 23-28, 1993
921993
Grain boundary misorientation angles and stress-induced voiding in oxide passivated copper interconnects
JA Nucci, RR Keller, DP Field, Y Shacham-Diamand
Applied physics letters 70 (10), 1242-1244, 1997
851997
Electrical properties of superfilled sub-micrometer silver metallizations
D Josell, C Burkhard, Y Li, YW Cheng, RR Keller, CA Witt, DR Kelley, ...
Journal of applied physics 96 (1), 759-768, 2004
662004
Epitaxial (111) films of Cu, Ni, and CuxNiy on α− Al2O3 (0001) for graphene growth by chemical vapor deposition
DL Miller, MW Keller, JM Shaw, AN Chiaramonti, RR Keller
Journal of Applied Physics 112 (6), 2012
652012
Local crystallographic texture and voiding in passivated copper interconnects
JA Nucci, RR Keller, JE Sanchez Jr, Y Shacham‐Diamand
Applied physics letters 69 (26), 4017-4019, 1996
631996
Specimen‐thickness effects on transmission Kikuchi patterns in the scanning electron microscope
KP Rice, RR Keller, MP Stoykovich
Journal of microscopy 254 (3), 129-136, 2014
592014
On the unique evaluation of local lattice parameters by convergent-beam electron diffraction
HJ Maier, RR Keller, H Renner, H Mughrabi, A Preston
Philosophical Magazine A 74 (1), 23-43, 1996
431996
On the onset of low-energy dislocation substructures in fatigue: grain size effects
R Keller, W Zielinski, WW Gerberich
Materials Science and Engineering: A 113, 267-280, 1989
421989
Giant secondary grain growth in Cu films on sapphire
DL Miller, MW Keller, JM Shaw, KP Rice, RR Keller, KM Diederichsen
AIP Advances 3 (8), 2013
402013
Local lattice parameter measurements in a creep-deformed nickel-base superalloy by convergent beam electron diffraction
RR Keller, HJ Maier, H Renner, H Mughrabi
Scripta metallurgica et materialia 27 (9), 1167-1172, 1992
331992
Strain-induced grain growth during rapid thermal cycling of aluminum interconnects
RR Keller, RH Geiss, N Barbosa, AJ Slifka, DT Read
Metallurgical and Materials Transactions A 38, 2263-2272, 2007
312007
Local textures and grain boundaries in voided copper interconnects
RR Keller, JA Nucci, DP Field
Journal of Electronic Materials 26, 996-1001, 1997
301997
Transmission imaging with a programmable detector in a scanning electron microscope
BW Caplins, JD Holm, RR Keller
Ultramicroscopy 196, 40-48, 2019
282019
Transmission electron diffraction from nanoparticles, nanowires and thin films in an SEM with conventional EBSD equipment
RH Geiss, RR Keller, DT Read
Microscopy and Microanalysis 16 (S2), 1742-1743, 2010
272010
Interconnect failure due to cyclic loading
RR Keller, R Mönig, CA Volkert, E Arzt, R Schwaiger, O Kraft
AIP Conference Proceedings 612 (1), 119-132, 2002
242002
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