Review of THz-based semiconductor assurance J True, C Xi, N Jessurun, K Ahi, N Asadizanjani
Optical Engineering 60 (6), 060901-060901, 2021
29 2021 Secure interposer-based heterogeneous integration MSM Khan, C Xi, AA Khan, MT Rahman, MM Tehranipoor, ...
IEEE Design & Test 39 (6), 156-164, 2022
16 2022 A framework to assess the security of advanced integrated circuit (ic) packaging C Xi, N Jessurun, N Asadizanjani
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-7, 2020
10 2020 Terahertz based machine learning approach to integrated circuit assurance J True, C Xi, N Jessurun, K Ahi, M Tehranipoor, N Asadizanjani
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2235-2245, 2021
9 2021 Exploring advanced packaging technologies for reverse engineering a system-in-package (sip) MSM Khan, C Xi, MSU Haque, MM Tehranipoor, N Asadizanjani
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023
6 2023 Machine learning assisted counterfeit ic detection through non-destructive infrared (ir) spectroscopy material characterization C Xi, N Jessurun, J True, AA Khan, MM Tehranipoor, N Asadizanjani
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2249-2255, 2022
5 2022 Physical assurance for heterogeneous integration: Challenges and opportunities C Xi, AA Khan, N Jessurun, N Vashisthan, MM Tehranipoor, ...
2022 IEEE International Symposium on the Physical and Failure Analysis of …, 2022
4 2022 Security challenges of MEMS devices in HI packaging AA Khan, K Sahebkar, C Xi, MM Tehranipoor, RF Need, N Asadizanjani
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2321-2327, 2022
4 2022 Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance D Johnson, PW Hsu, C Xi, N Asadizanjani
ISTFA 2021, 59-64, 2021
4 2021 Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub-7nm ICs-Exploring the Advantages of a Post-Photon Emission Technique N Varshney, C Xi, AA Khan, LK Biswas, V Sorger, H Dalir, N Asadizanjani
ISTFA 2023, 346-351, 2023
2 2023 Digital twin aided IC packaging structure analysis for high-quality sample preparation C Xi, AA Khan, J True, N Vashistha, N Jessurun, N Asadizanjani
2021 IEEE International Symposium on the Physical and Failure Analysis of …, 2021
1 2021 Printed circuit board obfuscation systems and methods N Asadi-Zanjani, T John, C Xi, A Khan
US Patent App. 18/463,988, 2024
2024 Enhancing counterfeit detection of integrated circuits through machine learning-assisted THz-TDS analysis C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024
2024 THz-TDS for IC packaging material changes detection under real-world conditions C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani
Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024
2024 Materials for Electronics Security and Assurance N Asadizanjani, C Xi, MM Tehranipoor
Elsevier, 2024
2024 : An X-Ray Compatibility Metric for Advanced Packages to Facilitate Design-for-InspectionMSM Khan, C Xi, N Varshney, AA Khan, A Serna, H Dalir, V Sorger, ...
2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2023
2023 Digital twin modeling of ic packaging structure N Asadi-Zanjani, T John, C Xi
US Patent App. 18/054,623, 2023
2023 Terahertz data collection for electronic object classification and evaluation N Asadi-Zanjani, T John, N Jessurun, C Xi
US Patent App. 17/664,596, 2023
2023 Microelectronic Encapsulant Material Assessment: A Security Point of View C Xi, J Nathan, N Asadizanjani
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 157-162, 2021
2021 PCB Netlist Obfuscation with Micro Electro Mechanical Systems and Additive Manufacturing Techniques J True, C Xi, A Khan, J Hihath, N Asadizanjani
ISTFA 2021, 172-178, 2021
2021