| Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications T Linz, R Vieroth, C Dils, M Koch, T Braun, KF Becker, C Kallmayer, ... Advances in science and technology 60, 85-94, 2009 | 103 | 2009 |
| Deubiquitinase USP10 regulates Notch signaling in the endothelium R Lim, T Sugino, H Nolte, J Andrade, B Zimmermann, C Shi, ... Science 364 (6436), 188-193, 2019 | 78 | 2019 |
| Large area compression molding for fan-out panel level packing T Braun, S Raatz, S Voges, R Kahle, V Bader, J Bauer, KF Becker, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1077-1083, 2015 | 76 | 2015 |
| TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules K Zoschke, J Wolf, C Lopper, I Kuna, N Jürgensen, V Glaw, K Samulewicz, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 836-843, 2011 | 67 | 2011 |
| High-temperature reliability of Flip Chip assemblies T Braun, KF Becker, M Koch, V Bader, R Aschenbrenner, H Reichl Microelectronics Reliability 46 (1), 144-154, 2006 | 67 | 2006 |
| Method for producing encapsulated chips KF Becker, T Braun, M Koch, A Ostmann, L Böttcher, E Jung US Patent 7,011,989, 2006 | 57 | 2006 |
| Fan-out wafer and panel level packaging as packaging platform for heterogeneous integration T Braun, KF Becker, O Hoelck, S Voges, R Kahle, M Dreissigacker, ... Micromachines 10 (5), 342, 2019 | 48 | 2019 |
| From wafer level to panel level mold embedding T Braun, KF Becker, S Voges, T Thomas, R Kahle, J Bauer, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1235-1242, 2013 | 48 | 2013 |
| 24"× 18" Fan-out panel level packing T Braun, KF Becker, S Voges, J Bauer, R Kahle, V Bader, T Thomas, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 940-946, 2014 | 45 | 2014 |
| Stackable system-on-packages with integrated components KF Becker, E Jung, A Ostmann, T Braun, A Neumann, R Aschenbrenner, ... IEEE Transactions on Advanced Packaging 27 (2), 268-277, 2004 | 45 | 2004 |
| Through mold vias for stacking of mold embedded packages T Braun, KF Becker, S Voges, T Thomas, R Kahle, V Bader, J Bauer, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 48-54, 2011 | 43 | 2011 |
| Panel Level Packaging-A view along the process chain T Braun, KF Becker, O Hoelck, R Kahle, M Wöhrmann, L Boettcher, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 70-78, 2018 | 36 | 2018 |
| Development of a multi-project fan-out wafer level packaging platform T Braun, S Raatz, U Maass, M Van Dijk, H Walter, O Hölck, KF Becker, ... 2017 IEEE 67th electronic components and technology conference (ECTC), 1-7, 2017 | 35 | 2017 |
| Large area embedding for heterogeneous system integration T Braun, KF Becker, L Böttcher, J Bauer, T Thomas, M Koch, R Kahle, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 32 | 2010 |
| Biocompatible hybrid flip chip microsystem integration for next generation wireless neural interfaces M Topper, M Klein, K Buschick, V Glaw, K Orth, O Ehrmann, M Hutter, ... 56th Electronic Components and Technology Conference 2006, 4 pp., 2006 | 30 | 2006 |
| High temperature potential of flip chip assemblies for automotive applications T Braun, KF Becker, JP Sommer, T Loher, K Schottenloher, R Kohl, ... Proceedings Electronic Components and Technology, 2005. ECTC'05., 376-383, 2005 | 29 | 2005 |
| Reliability potential of epoxy based encapsulants for automotive applications T Braun, KF Becker, M Koch, V Bader, R Aschenbrenner, H Reichl Microelectronics reliability 45 (9-11), 1672-1675, 2005 | 28 | 2005 |
| Wafer level package with integrated or embedded antenna I Ndip, T Braun US Patent 10,461,399, 2019 | 26 | 2019 |
| State-of-the-art of 3D SiP Technology T Thomas, FY Lin, KF Becker, T Braun, E Jung, R Aschenbrenner, ... Proceedings of IMAPS Poland 2, 2009 | 26 | 2009 |
| Material and process trends for moving from FOWLP to FOPLP T Braun, S Voges, M Töpper, M Wilke, M Wöhrmann, U Maaß, M Huhn, ... 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-6, 2015 | 24 | 2015 |
