Augmented reality as a telemedicine platform for remote procedural training S Wang, M Parsons, J Stone-McLean, P Rogers, S Boyd, K Hoover, ...
Sensors 17 (10), 2294, 2017
204 2017 SleepWalker: A 25-MHz 0.4-V Sub- 7- Microcontroller in 65-nm LP/GP CMOS for Low-Carbon Wireless Sensor Nodes D Bol, J De Vos, C Hocquet, F Botman, F Durvaux, S Boyd, D Flandre, ...
IEEE Journal of Solid-State Circuits 48 (1), 20-32, 2012
180 2012 A hybrid life cycle inventory of nano-scale semiconductor manufacturing N Krishnan, S Boyd, A Somani, S Raoux, D Clark, D Dornfeld
Environmental science & technology 42 (8), 3069-3075, 2008
161 2008 Life-cycle assessment of semiconductors SB Boyd
Springer Science & Business Media, 2011
84 2011 Life-cycle energy demand and global warming potential of computational logic SB Boyd, A Horvath, D Dornfeld
Environmental science & technology 43 (19), 7303-7309, 2009
71 2009 A 25MHz 7μW/MHz ultra-low-voltage microcontroller SoC in 65nm LP/GP CMOS for low-carbon wireless sensor nodes D Bol, J De Vos, C Hocquet, F Botman, F Durvaux, S Boyd, D Flandre, ...
2012 IEEE International Solid-State Circuits Conference, 490-492, 2012
56 2012 A 25MHz 7μW/MHz ultra-low-voltage microcontroller SoC in 65nm LP/GP CMOS for low-carbon wireless sensor nodes D Bol, J De Vos, C Hocquet, F Botman, F Durvaux, S Boyd, D Flandre, ...
2012 IEEE International Solid-State Circuits Conference, 490-492, 2012
56 2012 A systematic review of reviews: recruitment and retention of rural family physicians S Asghari, MC Kirkland, J Blackmore, S Boyd, A Farrell, J Rourke, ...
Canadian Journal of Rural Medicine 25 (1), 20-30, 2020
46 2020 Life-cycle assessment of computational logic produced from 1995 through 2010 SB Boyd, A Horvath, DA Dornfeld
Environmental Research Letters 5 (1), 014011, 2010
44 2010 Modified reporting of positive urine cultures to reduce inappropriate treatment of asymptomatic bacteriuria among nonpregnant, noncatheterized inpatients: a randomized … P Daley, D Garcia, R Inayatullah, C Penney, S Boyd
infection control & hospital epidemiology 39 (7), 814-819, 2018
37 2018 Life cycle inventory of a CMOS chip S Boyd, D Dornfeld, N Krishnan
Proceedings of the 2006 IEEE International Symposium on Electronics and the …, 2006
33 2006 Remote mentoring of point‐of‐care ultrasound skills to inexperienced operators using multiple telemedicine platforms: is a cell phone good enough? A Smith, R Addison, P Rogers, J Stone‐McLean, S Boyd, K Hoover, ...
Journal of Ultrasound in Medicine 37 (11), 2517-2525, 2018
32 2018 Life-cycle assessment of NAND flash memory S Boyd, A Horvath, D Dornfeld
IEEE Transactions on semiconductor manufacturing 24 (1), 117-124, 2010
29 2010 SurgeCon: priming a community emergency department for patient flow management C Patey, P Norman, M Araee, S Asghari, T Heeley, S Boyd, O Hurley, ...
Western Journal of Emergency Medicine 20 (4), 654, 2019
28 2019 Case studies in energy use to realize ultra-high purities in semiconductor manufacturing N Krishnan, ED Williams, SB Boyd
2008 IEEE International Symposium on Electronics and the Environment, 1-6, 2008
22 2008 Application-aware LCA of semiconductors: Life-cycle energy of microprocessors from high-performance 32nm CPU to ultra-low-power 130nm MCU D Bol, S Boyd, D Dornfeld
Proceedings of the 2011 IEEE International Symposium on Sustainable Systems …, 2011
17 2011 Using a hybrid approach to evaluate semiconductor life cycle environmental issues-a case study in interconnect module impacts N Krishnan, S Boyd, J Rosales, D Dornfeld, S Raoux, R Smati
IEEE International Symposium on Electronics and the Environment, 2004 …, 2004
16 2004 Life-cycle assessment of semiconductors SB Boyd
University of California, Berkeley, 2009
14 2009 Ultrapurity and energy use: Case study of semiconductor manufacturing E Williams, N Krishnan, S Boyd
Thermodynamics and the destruction of resources, 2011
12 2011 The unusual pattern of hereditary bleeding disorders in the province of Newfoundland and Labrador—Canada’s most Eastern Province MF Scully, J Stoffman, S Boyd
Transfusion and Apheresis Science 57 (6), 713-716, 2018
9 2018