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David Whalley
David Whalley
Geverifieerd e-mailadres voor lboro.ac.uk
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Thermal interface materials-A review of the state of the art
F Sarvar, DC Whalley, PP Conway
2006 1st electronic systemintegration technology conference 2, 1292-1302, 2006
2982006
Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
JF Li, SH Mannan, MP Clode, DC Whalley, DA Hutt
Acta Materialia 54 (11), 2907-2922, 2006
2052006
Direct-write techniques for maskless production of microelectronics: A review of current state-of-the-art technologies
Y Zhang, C Liu, D Whalley
2009 International Conference on Electronic Packaging Technology & High …, 2009
942009
A review of the impact of conductive adhesive technology on interconnection
AO Ogunjimi, O Boyle, DC Whalley, DJ Williams
Journal of Electronics Manufacturing 2 (03), 109-118, 1992
841992
Electroless nickel bumping of aluminum bondpads. I. Surface pretreatment and activation
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 87-97, 2002
672002
Conduction mechanisms in anisotropic conducting adhesive assembly
CN Oguibe, SH Mannan, DC Whalley, DJ Williams
Proceedings. The First IEEE International Symposium on Polymeric Electronics …, 1997
671997
Application of adhesives in MEMS and MOEMS assembly: A review
F Sarvar, DA Hutt, DC Whalley
2nd International IEEE Conference on Polymers and Adhesives in …, 2002
662002
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
JF Li, SH Mannan, MP Clode, K Chen, DC Whalley, C Liu, DA Hutt
Acta Materialia 55 (2), 737-752, 2007
652007
Anisotropic conducting adhesives for electronic interconnection
DJ Williams, DC Whalley, OA Boyle, AO Ogunjimi
Soldering & Surface Mount Technology, 1993
621993
A simplified reflow soldering process model
DC Whalley
Journal of Materials Processing Technology 150 (1-2), 134-144, 2004
582004
Effect of Al2O3 fibers on the thermal conductivity and mechanical properties of high density polyethylene with the absence and presence of compatibilizer
S Zhang, Y Ke, X Cao, Y Ma, F Wang
Journal of Applied Polymer Science 124 (6), 4874-4881, 2012
462012
The effects of conducting particle distribution on the behaviour of anisotropic conducting adhesives: non-uniform conductivity and shorting between connections
DJ Williams, DC Whalley
Journal of Electronics Manufacturing 3 (02), 85-94, 1993
431993
Anisotropic conducting adhesives for electronic assembly
DC Whalley, SH Mannan, DJ Williams
Assembly Automation, 1997
281997
A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin
K Chen, C Liu, DC Whalley, DA Hutt, JF Li, SH Mannan
Acta Materialia 56 (19), 5668-5676, 2008
262008
Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating
DA Hutt, C Liu, PP Conway, DC Whalley, SH Mannan
IEEE transactions on components and packaging technologies 25 (1), 98-105, 2002
262002
Models to determine guidelines for the anisotropic conducting adhesives joining process
SH Mannan, DJ Williams, DC Whalley, AO Ogunjimi
Conductive adhesives for electronics packaging, 78-98, 1999
231999
Thermal fatigue life estimation and delamination mechanics studies of multilayered MEMS structures
AR Maligno, DC Whalley, VV Silberschmidt
Microelectronics Reliability 52 (8), 1665-1678, 2012
212012
Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres
S Jain, DC Whalley, M Cottrill, H Kristiansen, K Redford, CB Nilsen, ...
18th European Microelectronics & Packaging Conference, 1-7, 2011
212011
Electroless Ni-WP alloys as barrier coatings for liquid solder interconnects
K Chen, C Liu, DC Whalley, DA Hutt, JF Li, SH Mannan
2006 1st Electronic Systemintegration Technology Conference 1, 421-427, 2006
212006
A simplified model of the reflow soldering process
DC Whalley
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical …, 2002
212002
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Artikelen 1–20