Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance X Cao, T Wang, KDT Ngo, GQ Lu Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 129 | 2011 |
Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver G Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ Lu IEEE Transactions on Device and Materials Reliability 12 (1), 124-132, 2011 | 75 | 2011 |
Planar power module with low thermal impedance and low thermomechanical stress X Cao, GQ Lu, KDT Ngo IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012 | 51 | 2012 |
Transient thermal impedance measurements on low-temperature-sintered nanoscale silver joints Y Mei, T Wang, X Cao, G Chen, GQ Lu, X Chen Journal of electronic materials 41, 3152-3160, 2012 | 33 | 2012 |
Parametric Study of Joint Height for a Medium-Voltage Planar Package X Cao, T Wang, KDT Ngo, GQ Lu Components and Packaging Technologies, IEEE Transactions on 33 (3), 553-562, 2010 | 28 | 2010 |
Thermal design of power module to minimize peak transient temperature X Cao, KDT Ngo, GQ Lu Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP'09 …, 2009 | 21 | 2009 |
Height Optimization for a Medium-Voltage Planar Package X Cao, T Wang, KDT Ngo, GQ Lu Applied Power Electronics Conference and Exposition, 2009. APEC 2009. Twenty …, 2009 | 10 | 2009 |
Fast response control of stepping inductance voltage regulator module X Cao, R Oruganti 2005 IEEE 36th Power Electronics Specialists Conference, 382-388, 2005 | 9 | 2005 |
Development of a double-side cooled power module joined by low-temperature sintering of nanosilver paste for electric vehicles X Cao, T Wang, Z Tan, K Ngo, S Luo, GQ Lu IMAPS’s 2nd Advanced Technology Workshop on Automotive Microelec. and Packaging, 2010 | 6 | 2010 |
Boundary-dependent circuit model for the transient behavior of a thermal stack in power modules X Cao, GQ Lu, K Ngo 2011 IEEE Energy Conversion Congress and Exposition, 1853-1860, 2011 | 5 | 2011 |
Optimization of bonding geometry for a planar power module to minimize thermal impedance and thermo-mechanical stress X Cao Virginia Tech, 2011 | 1 | 2011 |
Characterization of Lead-Free Solder and Sintered Nano-Silver Die-Attach Layers Using Thermal Impedance....................... X Cao, T Wang, KDT Ngo, GQ Lu, G Sharma, A Kumar, VS Rao, SW Ho, ... | | |