| Verification: Accuracy evaluation of WiFi fine time measurements on an open platform M Ibrahim, H Liu, M Jawahar, V Nguyen, M Gruteser, R Howard, B Yu, ... Proceedings of the 24th Annual International Conference on Mobile Computing …, 2018 | 115 | 2018 |
| Dependency of dishing on polish time and slurry chemistry in Cu CMP V Nguyen, H VanKranenburg, P Woerlee Microelectronic Engineering 50 (1-4), 403-410, 2000 | 94 | 2000 |
| High-rate flicker-free screen-camera communication with spatially adaptive embedding V Nguyen, Y Tang, A Ashok, M Gruteser, K Dana, W Hu, E Wengrowski, ... IEEE INFOCOM 2016-The 35th Annual IEEE International Conference on Computer …, 2016 | 62 | 2016 |
| Copper chemical mechanical polishing using a slurry-free technique VH Nguyen, AJ Hof, H Van Kranenburg, PH Woerlee, F Weimar Microelectronic engineering 55 (1-4), 305-312, 2001 | 50 | 2001 |
| Advanced Cu interconnects using air gaps LG Gosset, A Farcy, J De Pontcharra, P Lyan, R Daamen, G Verheijden, ... Microelectronic engineering 82 (3-4), 321-332, 2005 | 46 | 2005 |
| System and method for estimating the junction temperature of a light emitting diode VN Hoang, R Surdeanu, P Bancken, B Bataillou, D Van Steenwinckel US Patent 8,534,914, 2013 | 43 | 2013 |
| Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process VH Nguyen, R Daamen, R Hoofman Microelectronic Engineering 76 (1-4), 95-99, 2004 | 39 | 2004 |
| Visible light based activity sensing using ceiling photosensors M Ibrahim, V Nguyen, S Rupavatharam, M Jawahar, M Gruteser, ... Proceedings of the 3rd Workshop on Visible Light Communication Systems, 43-48, 2016 | 35 | 2016 |
| The evolution of multi-level air gap integration towards 32 nm node interconnects R Daamen, PHL Bancken, VH Nguyen, A Humbert, G Verheijden, ... Microelectronic engineering 84 (9-10), 2177-2183, 2007 | 33 | 2007 |
| A physical model for dishing during metal CMP VH Nguyen, R Daamen, H van Kranenburg, P van der Velden, ... Journal of the Electrochemical Society 150 (11), G689, 2003 | 33 | 2003 |
| Demonstration of asymmetric gate-oxide thickness four-terminal FinFETs having flexible threshold voltage and good subthreshold slope M Masahara, R Surdeanu, L Witters, G Doornbos, VH Nguyen, ... IEEE Electron Device Letters 28 (3), 217-219, 2007 | 30 | 2007 |
| Intramolecular fluorine migration via four-member cyclic transition states V Nguyen, PS Mayer, TH Morton The Journal of Organic Chemistry 65 (23), 8032-8040, 2000 | 29 | 2000 |
| Demonstration of an extendable and industrial 300mm BEOL integration for the 65-nm technology node O Hinsinger, R Fox, E Sabouret, C Goldberg, C Verove, W Besling, P Brun, ... IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004 | 26 | 2004 |
| Eyelight: Light-and-shadow-based occupancy estimation and room activity recognition V Nguyen, M Ibrahim, S Rupavatharam, M Jawahar, M Gruteser, ... IEEE INFOCOM 2018-IEEE Conference on Computer Communications, 351-359, 2018 | 24 | 2018 |
| Do not share! Invisible light beacons for signaling preferences to privacy-respecting cameras A Ashok, V Nguyen, M Gruteser, N Mandayam, W Yuan, K Dana Proceedings of the 1st ACM MobiCom workshop on Visible light communication …, 2014 | 22 | 2014 |
| Panoptes: Servicing multiple applications simultaneously using steerable cameras S Jain, V Nguyen, M Gruteser, P Bahl Proceedings of the 16th ACM/IEEE International Conference on Information …, 2017 | 21 | 2017 |
| Integrated circuit comprising a gas sensor A Humbert, R Daamen, VH Nguyen US Patent 9,263,500, 2016 | 20 | 2016 |
| Multi-level air gap integration for 32/22nm nodes using a spin-on thermal degradable polymer and a SiOC CVD hard mask R Daamen, PHL Bancken, DE Badaroglu, J Michelon, VH Nguyen, ... 2007 IEEE International Interconnect Technology Conferencee, 61-63, 2007 | 17 | 2007 |
| The effect of copper design rules on inductor performance C Detcheverry, W van Noort, R Hoofman, L Tiemeijer, VH Nguyen, ... ESSDERC'03. 33rd Conference on European Solid-State Device Research, 2003 …, 2003 | 17 | 2003 |
| Testing of leds P Bancken, VN Hoang, R Surdeanu US Patent App. 12/876,075, 2011 | 16 | 2011 |
