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Viet Hoang Nguyen
Viet Hoang Nguyen
Senior Principal Scientist, NXP semiconductors
Verified email at nxp.com
Title
Cited by
Cited by
Year
Verification: Accuracy evaluation of WiFi fine time measurements on an open platform
M Ibrahim, H Liu, M Jawahar, V Nguyen, M Gruteser, R Howard, B Yu, ...
Proceedings of the 24th Annual International Conference on Mobile Computing …, 2018
1152018
Dependency of dishing on polish time and slurry chemistry in Cu CMP
V Nguyen, H VanKranenburg, P Woerlee
Microelectronic Engineering 50 (1-4), 403-410, 2000
942000
High-rate flicker-free screen-camera communication with spatially adaptive embedding
V Nguyen, Y Tang, A Ashok, M Gruteser, K Dana, W Hu, E Wengrowski, ...
IEEE INFOCOM 2016-The 35th Annual IEEE International Conference on Computer …, 2016
622016
Copper chemical mechanical polishing using a slurry-free technique
VH Nguyen, AJ Hof, H Van Kranenburg, PH Woerlee, F Weimar
Microelectronic engineering 55 (1-4), 305-312, 2001
502001
Advanced Cu interconnects using air gaps
LG Gosset, A Farcy, J De Pontcharra, P Lyan, R Daamen, G Verheijden, ...
Microelectronic engineering 82 (3-4), 321-332, 2005
462005
System and method for estimating the junction temperature of a light emitting diode
VN Hoang, R Surdeanu, P Bancken, B Bataillou, D Van Steenwinckel
US Patent 8,534,914, 2013
432013
Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process
VH Nguyen, R Daamen, R Hoofman
Microelectronic Engineering 76 (1-4), 95-99, 2004
392004
Visible light based activity sensing using ceiling photosensors
M Ibrahim, V Nguyen, S Rupavatharam, M Jawahar, M Gruteser, ...
Proceedings of the 3rd Workshop on Visible Light Communication Systems, 43-48, 2016
352016
The evolution of multi-level air gap integration towards 32 nm node interconnects
R Daamen, PHL Bancken, VH Nguyen, A Humbert, G Verheijden, ...
Microelectronic engineering 84 (9-10), 2177-2183, 2007
332007
A physical model for dishing during metal CMP
VH Nguyen, R Daamen, H van Kranenburg, P van der Velden, ...
Journal of the Electrochemical Society 150 (11), G689, 2003
332003
Demonstration of asymmetric gate-oxide thickness four-terminal FinFETs having flexible threshold voltage and good subthreshold slope
M Masahara, R Surdeanu, L Witters, G Doornbos, VH Nguyen, ...
IEEE Electron Device Letters 28 (3), 217-219, 2007
302007
Intramolecular fluorine migration via four-member cyclic transition states
V Nguyen, PS Mayer, TH Morton
The Journal of Organic Chemistry 65 (23), 8032-8040, 2000
292000
Demonstration of an extendable and industrial 300mm BEOL integration for the 65-nm technology node
O Hinsinger, R Fox, E Sabouret, C Goldberg, C Verove, W Besling, P Brun, ...
IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 …, 2004
262004
Eyelight: Light-and-shadow-based occupancy estimation and room activity recognition
V Nguyen, M Ibrahim, S Rupavatharam, M Jawahar, M Gruteser, ...
IEEE INFOCOM 2018-IEEE Conference on Computer Communications, 351-359, 2018
242018
Do not share! Invisible light beacons for signaling preferences to privacy-respecting cameras
A Ashok, V Nguyen, M Gruteser, N Mandayam, W Yuan, K Dana
Proceedings of the 1st ACM MobiCom workshop on Visible light communication …, 2014
222014
Panoptes: Servicing multiple applications simultaneously using steerable cameras
S Jain, V Nguyen, M Gruteser, P Bahl
Proceedings of the 16th ACM/IEEE International Conference on Information …, 2017
212017
Integrated circuit comprising a gas sensor
A Humbert, R Daamen, VH Nguyen
US Patent 9,263,500, 2016
202016
Multi-level air gap integration for 32/22nm nodes using a spin-on thermal degradable polymer and a SiOC CVD hard mask
R Daamen, PHL Bancken, DE Badaroglu, J Michelon, VH Nguyen, ...
2007 IEEE International Interconnect Technology Conferencee, 61-63, 2007
172007
The effect of copper design rules on inductor performance
C Detcheverry, W van Noort, R Hoofman, L Tiemeijer, VH Nguyen, ...
ESSDERC'03. 33rd Conference on European Solid-State Device Research, 2003 …, 2003
172003
Testing of leds
P Bancken, VN Hoang, R Surdeanu
US Patent App. 12/876,075, 2011
162011
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Articles 1–20