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- Jared M JohnsonThe Ohio State UniversityVerified email at thermofisher.com
- Hsien-Lien Huang [ORCID:0000-0001...The Ohio State UniversityVerified email at osu.edu
- Menglin Zhu [ORCID: 0000-0001-683...Postdoctoral Researcher, MITVerified email at mit.edu
- Hongping ZhaoProfessor of Electrical & Computer Engineering, Materials Science & Engineering, OSUVerified email at osu.edu
- Siddharth RajanElectrical and Computer Engineering, Ohio State UniversityVerified email at ece.osu.edu
- A F M Anhar Uddin BhuiyanAssistant Professor, Electrical and Computer Engineering, University of Massachusetts LowellVerified email at uml.edu
- Zixuan FengThe Ohio State UniversityVerified email at osu.edu
- Paul VoylesUniversity of Wisconsin, MadisonVerified email at wisc.edu
- Yuewei ZhangUCSBVerified email at ucsb.edu
- Sriram KrishnamoorthyUniversity of California, Santa BarbaraVerified email at ucsb.edu
- Jack ZhangUCSBVerified email at umail.ucsb.edu
- Zhanbo XiaPost Doctoral Scholar, ECE, The Ohio State UniversityVerified email at osu.edu
- Chandan JoishiResearch Scientist, The Ohio State UniversityVerified email at osu.edu
- Baishakhi MazumderUniversity at BuffaloVerified email at buffalo.edu
- Soohyun ImThe State University of New York at BuffaloVerified email at buffalo.edu
- Matthew J. KramerDistinguished Scientist, Materials Sciences and Engineering, Ames National LaboratoryVerified email at ameslab.gov
- Ambrose SeoUniversity of KentuckyVerified email at uky.edu
- Sanyam BajajIntel CorporationVerified email at intel.com
- Chris G. Van de WalleProfessor of Materials, University of California, Santa BarbaraVerified email at mrl.ucsb.edu
- Yunus Eren KalayMiddle East Technical UniversityVerified email at metu.edu.tr
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Jinwoo Hwang
Associate Professor, Materials Science and Engineering, Ohio State University
Verified email at osu.edu - Homepage