Yuandong Guo
Title
Cited by
Cited by
Year
电磁兼容设计与整改对策及案例分析
朱文立
Dian zi gong ye chu ban she, 2012
222012
Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack
S Yang, B Orr, Y Guo, Y Zhang, D Pommerenke, H Shumiya, J Maeshima, ...
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 41-45, 2016
142016
Multi-Ports ([) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization
B Chen, J He, Y Guo, S Pan, X Ye, J Fan
IEEE Transactions on Electromagnetic Compatibility 61 (4), 1261-1270, 2019
132019
Differential S-parameter de-embedding for 8-port network
B Chen, J He, X Sun, Y Guo, S Jin, X Ye, J Fan
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018
132018
IEC 61000-4-2 ESD test in display down configurationfor cell phones
J Zhou, S Shinde, Y Guo, A Talebzadeh, S Marathe, Y Gan, KH Kim, ...
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016
122016
Simultaneous measurement of electric and magnetic fields with a dual probe for efficient near-field scanning
W Shao, W Fang, Y Huang, G Li, L Wang, Z He, E Shao, Y Guo, Y En, ...
IEEE Transactions on Antennas and Propagation 67 (4), 2859-2864, 2019
82019
Measurement techniques to identify soft failure sensitivity to ESD
J Zhou, Y Guo, S Shinde, A Hosseinbeig, A Patnaik, OH Izadi, C Zeng, ...
IEEE transactions on electromagnetic compatibility 62 (4), 1007-1016, 2019
72019
Investigation of segmentation method for enhancing high frequency simulation accuracy of Q3D extractor
C Che, H Zhao, Y Guo, J Hu, H Kim
2019 IEEE International Conference on Computational Electromagnetics (ICCEM …, 2019
72019
Causality analyzing for transmission line with surface roughness
X Sun, Y Guo, Y Sun, K Song, L Ye, X Ye, JL Drewniak, J Fan
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
62019
Limitations of First-Order Surface Impedance Boundary Condition and Its Effect on 2D Simulations for PCB Transmission Lines
Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
52020
Study of TDR impedance for better analysis to measurement correlation
Y Guo, B Chen, X Sun, X Ye, J Hsu, J Fan
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo …, 2019
52019
浪涌防护设计思路与常见防护电路
余海涛, 郭远东, 李雪玲
环境技术, 21-24, 2013
52013
A Cross-sectional Profile Based Model for Stripline Conductor Surface Roughness
S Yong, V Khilkevich, Y Liu, R He, Y Guo, H Gao, S Hinaga, D Padilla, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
42020
8-Port network de-embedding by using SFD
B Chen, J He, X Sun, Y Guo, S Jin, X Ye, J Fan
Electromagnetic Compatibility (EMC), 2018 IEEE International Symposium, 2018
42018
电磁兼容设计如何融入电子产品的设计流程
郭远东
电子产品可靠性与环境试验 29 (6), 56-60, 2011
32011
LED 舞台灯电磁兼容整改实例 [J]
郭远东
江南大学学报: 自然科学版 10 (009), 63-66, 2011
32011
高频无极灯电源端子骚扰电压整改实例
王颍凯, 郭远东
安全与电磁兼容, 65-66, 2008
32008
Robust Extended Unterminated Line (EUL) Crosstalk Characterization Techniques for High-Speed Interconnect
Y Guo, DH Kim, J He, X Ye, A Sutono, V Kunda, A Luoh, Z Kiguradze, ...
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020
22020
Ground bridge effect on reduction of conducted emission from three-phase motor drive system
Y Guo, S Penugonda, M Kim, J Lee, J Ha, S Yun, J Fan, H Kim
2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019
22019
IV Method Based PDN Impedance Measurement Technique and Associated Probe Design
X Zhu, L Zhang, Y Guo, P Wei, R Zai, J Drewniak, D Pommerenke
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019
22019
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