| Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects S Masahito, Y Kashiwagi, Y Li, K Arstila, O Richard, DJ Cott, M Heyns, ... Nanotechnology 22 (8), 085302, 2011 | 124 | 2011 |
| Influence of absorbed water components on SiOCH low-k reliability Y Li, I Ciofi, L Carbonell, N Heylen, J Van Aelst, MR Baklanov, ... Journal of Applied Physics 104 (3), 2008 | 104 | 2008 |
| Integration and electrical characterization of carbon nanotube via interconnects Y Li, DJ Cott, S Mertens, N Peys, M Heyns, S De Gendt, G Groeseneken, ... Microelectronic Engineering 88 (5), 837-843, 2011 | 77 | 2011 |
| Electrical reliability challenges of advanced low-k dielectrics C Wu, Y Li, MR Baklanov, K Croes ECS Journal of Solid State Science and Technology 4 (1), N3065, 2014 | 61 | 2014 |
| Low field TDDB of BEOL interconnects using> 40 months of data K Croes, P Roussel, Y Barbarin, C Wu, Y Li, J Bömmels, Z Tőkei 2013 IEEE International Reliability Physics Symposium (IRPS), 2F. 4.1-2F. 4.8, 2013 | 44 | 2013 |
| Internal photoemission of electrons at interfaces of metals with low-κ insulators S Shamuilia, VV Afanas’ev, P Somers, A Stesmans, YL Li, Z Tőkei, ... Applied physics letters 89 (20), 2006 | 44 | 2006 |
| Reliability challenges for copper low-k dielectrics and copper diffusion barriers Z Tökei, YL Li, GP Beyer Microelectronics Reliability 45 (9-11), 1436-1442, 2005 | 40 | 2005 |
| Current understanding of BEOL TDDB lifetime models K Croes, C Wu, D Kocaay, Y Li, P Roussel, J Boemmels, Z Tőkei ECS Journal of Solid State Science and Technology 4 (1), N3094, 2014 | 38 | 2014 |
| Reliability Challenges Related to TSV Integration and 3-D Stacking. K Croes, J De Messemaeker, Y Li, W Guo, OV Pedreira, V Cherman, ... IEEE Des. Test 33 (3), 37-45, 2016 | 34 | 2016 |
| Active-lite interposer for 2.5 & 3D integration G Hellings, M Scholz, M Detalle, D Velenis, MP de ten Broeck, CR Neve, ... 2015 Symposium on VLSI Circuits (VLSI Circuits), T222-T223, 2015 | 32 | 2015 |
| Small pitch, high aspect ratio via-last TSV module S Van Huylenbroeck, M Stucchi, Y Li, J Slabbekoorn, N Tutunjyan, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 43-49, 2016 | 30 | 2016 |
| Electrical characterization method to study barrier integrity in 3D through-silicon vias YL Li, D Velenis, T Kauerauf, M Stucchi, Y Civale, A Redolfi, K Croes 2012 IEEE 62nd Electronic Components and Technology Conference, 304-308, 2012 | 26 | 2012 |
| Real-time investigation of conduction mechanism with bias stress in silica-based intermetal dielectrics Y Li, G Groeseneken, K Maex, Z Tokei IEEE Transactions on Device and Materials Reliability 7 (2), 252-258, 2007 | 21 | 2007 |
| Advanced metallization scheme for 3× 50µm via middle TSV and beyond S Van Huylenbroeck, Y Li, N Heylen, K Croes, G Beyer, E Beyne, M Brouri, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 66-72, 2015 | 20 | 2015 |
| Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers B Guo, L Wen, P Helin, G Claes, A Verbist, R Van Hoof, B Du Bois, ... 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011 | 20 | 2011 |
| Impact of barrier integrity on liner reliability in 3D through silicon vias Y Li, Y Civale, Y Oba, A Cockburn, JH Park, E Beyne, I De Wolf, K Croes 2013 IEEE International Reliability Physics Symposium (IRPS), 5C. 5.1-5C. 5.5, 2013 | 18 | 2013 |
| Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability YL Li, Z Tökei, P Roussel, G Groeseneken, K Maex Microelectronics Reliability 45 (9-11), 1299-1304, 2005 | 18 | 2005 |
| CMP process optimization for improved compatibility with advanced metal liners N Heylen, L Yunlong, K Kellens, L Carbonell, H Volders, G Santoro, ... 2010 IEEE International Interconnect Technology Conference, 1-3, 2010 | 16 | 2010 |
| A highly reliable 1× 5μm via-last TSV module S Van Huylenbroeck, Y Li, J De Vos, G Jamieson, N Tutunjyan, A Miller, ... 2018 IEEE International Interconnect Technology Conference (IITC), 94-96, 2018 | 13 | 2018 |
| Correlation between stress-induced leakage current and dielectric degradation in ultra-porous SiOCH low-k materials C Wu, Y Li, A Leśniewska, O Varela Pedreira, JF de Marneffe, I Ciofi, ... Journal of Applied Physics 118 (16), 2015 | 13 | 2015 |
Yohan BarbarinTU Eindhoven => ETH Zurich => Imec => CEAVerified email at cea.fr
