Raghuram (Raghu) V. Pucha
Raghuram (Raghu) V. Pucha
Faculty, School of Mechanical Engineering, Georgia Tech
Verified email at me.gatech.edu - Homepage
Title
Cited by
Cited by
Year
A computational model of ceramic microstructures subjected to multi-axial dynamic loading
PD Zavattieri, PV Raghuram, HD Espinosa
Journal of the Mechanics and Physics of Solids 49 (1), 27-68, 2001
1422001
Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias
V Sukumaran, T Bandyopadhyay, Q Chen, N Kumbhat, F Liu, R Pucha, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 583-588, 2011
862011
Defining the lower and upper limit of the effective modulus of CNT/polypropylene composites through integration of modeling and experiments
MA Bhuiyan, RV Pucha, J Worthy, M Karevan, K Kalaitzidou
Composite Structures 95, 80-87, 2013
652013
Tensile modulus of carbon nanotube/polypropylene composites-A computational study based on experimental characterization
MA Bhuiyan, RV Pucha, M Karevan, K Kalaitzidou
Computational Materials Science, 2011
652011
An enhanced constitutive material model for machining of Ti–6Al–4V alloy
R Liu, S Melkote, R Pucha, J Morehouse, X Man, T Marusich
Journal of Materials Processing Technology 213 (12), 2238-2246, 2013
562013
2004 54th Electronic Components and Technology Conference
IEEE Components, Manufacturing Technology Society Staff
Institute of Electrical & Electronics Engineers (IEEE), 2004
492004
Understanding the effect of CNT characteristics on the tensile modulus of CNT reinforced polypropylene using finite element analysis
MA Bhuiyan, RV Pucha, J Worthy, K Kalaitzidou
Computational Materials Science, 2013
342013
Computational Homogenization in RVE Models with Material Periodic Conditions for CNT Polymer Composites
S Wonsup, V Krishnaswamy, RV Pucha
Composite Structures 137 (March 2016), 9-17, 2016
322016
Thermomechanical reliability of underfilled BGA packages
J Pyland, RV Pucha, SK Sitararnan
IEEE transactions on electronics packaging manufacturing 25 (2), 100-106, 2002
312002
Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages
K Demir, K Ramachandran, Y Sato, Q Chen, V Sukumaran, R Pucha, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 353-359, 2013
302013
Effect of interphase modulus and nanofiller agglomeration on the tensile modulus of graphite nanoplatelets and carbon nanotube reinforced polypropylene nanocomposites
M Karevan, RV Pucha, M Bhuiyan, K Kalaitzidou
Carbon Letters 11 (4), 325-331, 2010
302010
Design and demonstration of low cost, panel-based polycrystalline silicon interposer with through-package-vias (TPVs)
Q Chen, T Bandyopadhyay, Y Suzuki, F Liu, V Sundaram, R Pucha, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 855-860, 2011
262011
Accelerated thermal cycling: Is it different for lead-free solder?
K Tunga, K Kacker, RV Pucha, SK Sitaraman
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
202004
First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers
K Demir, A Armutlulu, J Tong, R Pucha, V Sundaram, R Tummala
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1098-1102, 2014
192014
Learning-Centered Instruction of Engineering Graphics for Freshman Engineering Students
R Pucha, T Utsching
Journal of STEM Education 13 (4), 24-33, 2012
182012
Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures
RV Pucha, G Ramakrishna, S Mahalingam, SK Sitaraman
International journal of fatigue 26 (9), 947-957, 2004
182004
Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly
N Kumbhat, PM Raj, RV Pucha, V Sundaram, R Doraiswami, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
172004
A high precision coupled bending–extension triangular finite element for laminated plates
PV Raghuram, AVK Murty
Computers & structures 72 (6), 763-777, 1999
171999
Accelerated thermal cycling guidelines for electronic packages in military avionics thermal environment
RV Pucha, K Tunga, J Pyland, SK Sitaraman
J. Electron. Packag. 126 (2), 256-264, 2004
142004
Damage metric-based mapping approaches for developing accelerated thermal cycling guidelines for electronic packages
R Pucha, J Pyland, SK Sitaraman
International Journal of Damage Mechanics 10 (3), 214-234, 2001
142001
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