Qian Wang
Qian Wang
M.S. Student of Electrical and Computer Engineering Department, Missouri University of Science and
Verified email at mst.edu
Cited by
Cited by
Real-time visualization of Karman vortex street in water flow field by using digital holography
W Sun, J Zhao, J Di, Q Wang, L Wang
Optics express 17 (22), 20342-20348, 2009
Redistributing energy flow and polarization of a focused azimuthally polarized beam with rotationally symmetric sector-shaped obstacles
X Jiao, S Liu, Q Wang, X Gan, P Li, J Zhao
Optics letters 37 (6), 1041-1043, 2012
Real-time monitoring of the solution concentration variation during the crystallization process of protein-lysozyme by using digital holographic interferometry
Y Zhang, J Zhao, J Di, H Jiang, Q Wang, J Wang, Y Guo, D Yin
Optics express 20 (16), 18415-18421, 2012
Visual and quantitative measurement of the temperature distribution of heat conduction process in glass based on digital holographic interferometry
Q Wang, J Zhao, X Jiao, J Di, H Jiang
Journal of Applied Physics 111 (9), 093111, 2012
Utilisation of adsorption and desorption for simultaneously improving protein crystallisation success rate and crystal quality
DCY Yun-Zhu Guo, Li-Hua Sun, Dominik Oberthuer, Chen-Yan Zhang, Jian-Yu Shi ...
Scientific Reports 4 (7308), 1-8, 2014
Effectiveness analysis of de-embedding method for typical TSV pairs in a silicon interposer
Q Wang, K Shringarpure, B Chen, J Fan, C Hwang, S Pan, B Achkir
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2014 …, 2014
Modeling optimization of test patterns used in de-embedding method for through silicon via (TSV) measurement in silicon interposer
Q Wang, N Erickson, J Cho, C Hwang, J Fan, F de Paulis, S Piersanti, ...
Electromagnetic Compatibility (EMC), 2016 IEEE International Symposium on …, 2016
Differential probe characterization
Q Wang, Y Gao, J Fan, J Drewniak, R Zai
Electromagnetic Compatibility (EMC), 2016 IEEE International Symposium on …, 2016
Designing test patterns for effective measurement of typical TSV pairs in a silicon interposer
Qian Wang, Ketan Shringarpure, Jun Fan,Chulsoon Hwang, Siming Pan, Brice Achkir
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International …, 2014
TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization
F de Paulis, S Piersanti, Q Wang, J Cho, N Erickson, B Achkir, J Fan, ...
IEEE Transactions on Instrumentation and Measurement 66 (4), 792-801, 2017
Novel De-Embedding Methodology and Broadband Microprobe Measurement for Through-Silicon Via Pair in Silicon Interposer
Q Wang, J Cho, N Erickson, C Hwang, F De Paulis, S Piersanti, A Orlandi, ...
IEEE Transactions on Electromagnetic Compatibility, 2017
Digital speckle shearing interferometry use of linear CCD scanning
J Zhao, J Di, W Sun, Q Wang, X Jiao, X Yan
Fourth International Conference on Experimental Mechanics, 75224R-75224R-6, 2009
A Methodology to Generate a Time-varying Adjustable Wave Impedance inside a TEM Cell
Guanghua Li, VAK Prabhala, Abhinav Saxena, Qian Wang, Pratik Maheshwari ...
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on …, 2014
Electrical Performance Analysis and Modeling Optimization of Test Patterns Used in De-embedding Method for Through Silicon Via (TSV) Pair in Silicon Interposer
N Erickson, Q Wang, J Cho, C Hwang, F Paulis, S Piersanti, B Achkir, ...
USA, 2016
De-embedding method for electrical response extraction of through-silicon via (TSV) in silicon interposer technology and signal integrity performance comparison with embedded …
Q Wang
Missouri University of Science and Technology, 2016
邸江磊, 赵建林, 张颜艳, 王骏, 王倩
2011 西部光子学学术会议论文摘要集, 2011
王倩, 赵建林, 邸江磊, 焦向阳, 吴冰静
2011 西部光子学学术会议论文摘要集, 2011
焦向阳, 赵建林, 王倩
2011 西部光子学学术会议论文摘要集, 2011
张颜艳, 赵建林, 邸江磊, 王倩
2011 西部光子学学术会议论文摘要集, 2011
焦向阳, 赵建林, 王倩, 甘雪涛, 闫晓博
2010 年西部光子学学术会议摘要集, 2010
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