| A review of small heat pipes for electronics X Chen, H Ye, X Fan, T Ren, G Zhang Applied Thermal Engineering 96, 1-17, 2016 | 330 | 2016 |
| Mechanics of microelectronics GQ Zhang, WD Van Driel, XJ Fan Springer Science & Business Media, 2006 | 250 | 2006 |
| Solid state lighting reliability part 2 WD Van Driel, XJ Fan, GQ Zhang Cham, Switzerland: Springer (2017), 527-547, 2017 | 233 | 2017 |
| Experimental investigations and model study of moisture behaviors in polymeric materials XJ Fan, SWR Lee, Q Han Microelectronics Reliability 49 (8), 861-871, 2009 | 208 | 2009 |
| Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives H Tang, LN Sacco, S Vollebregt, H Ye, X Fan, G Zhang Journal of Materials Chemistry A 8 (47), 24943-24976, 2020 | 154 | 2020 |
| Design and optimization of thermo-mechanical reliability in wafer level packaging XJ Fan, B Varia, Q Han Microelectronics Reliability 50 (4), 536-546, 2010 | 150 | 2010 |
| Moisture Sensitivity of Plastic Packages of IC Devices XJFE Suhir Springer, 2010 | 135* | 2010 |
| Moisture Sensitivity of Plastic Packages of IC Devices XJFE Suhir Springer, 2010 | 135* | 2010 |
| An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling V Vasudevan, X Fan 2008 58th Electronic components and technology conference, 139-145, 2008 | 133 | 2008 |
| Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction H Tang, Y Li, R Sokolovskij, L Sacco, H Zheng, H Ye, H Yu, X Fan, H Tian, ... ACS applied materials & interfaces 11 (43), 40850-40859, 2019 | 122 | 2019 |
| Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading XJ Fan, HB Wang, TB Lim IEEE Transactions on Components and Packaging Technologies 24 (1), 84-91, 2001 | 119 | 2001 |
| Interfacial delamination mechanisms during soldering reflow with moisture preconditioning X Fan, GQ Zhang, WD Van Driel, LJ Ernst IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008 | 115 | 2008 |
| PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers B Sun, X Fan, C Qian, G Zhang IEEE Transactions on Industrial Electronics 63 (11), 6726-6735, 2016 | 111 | 2016 |
| Dual stage modeling of moisture absorption and desorption in epoxy mold compounds MD Placette, X Fan, JH Zhao, D Edwards Microelectronics Reliability 52 (7), 1401-1408, 2012 | 101 | 2012 |
| Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages X Fan, M Pei, PK Bhatti 56th Electronic Components and Technology Conference 2006, 9 pp., 2006 | 100 | 2006 |
| Mechanics of moisture for polymers: fundamental concepts and model study X Fan EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 96 | 2008 |
| Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages X Fan, G Rasier, VS Vasudevan Proceedings Electronic Components and Technology, 2005. ECTC'05., 901-906, 2005 | 90 | 2005 |
| A micromechanics-based vapor pressure model in electronic packages XJ Fan, J Zhou, GQ Zhang, LJ Ernst | 87 | 2005 |
| Degradation modeling of mid-power white-light LEDs by using Wiener process J Huang, DS Golubović, S Koh, D Yang, X Li, X Fan, GQ Zhang Optics express 23 (15), A966-A978, 2015 | 86 | 2015 |
| Direct concentration approach of moisture diffusion and whole-field vapor pressure modeling for reflow process—part I: theory and numerical implementation B Xie, XJ Fan, XQ Shi, H Ding | 82 | 2009 |
Jiang ZhouProfessor, Lamar UniversityVerified email at lamar.edu
