Xuejun Fan
Cited by
Cited by
A review of small heat pipes for electronics
X Chen, H Ye, X Fan, T Ren, G Zhang
Applied Thermal Engineering 96, 1-17, 2016
Mechanics of microelectronics
GQ Zhang, WD Van Driel, XJ Fan
Springer Science & Business Media, 2006
Solid state lighting reliability: components to systems
WD Van Driel, XJ Fan
Springer Science & Business Media, 2012
Experimental investigations and model study of moisture behaviors in polymeric materials
XJ Fan, SWR Lee, Q Han
Microelectronics Reliability 49 (8), 861-871, 2009
Design and optimization of thermo-mechanical reliability in wafer level packaging
XJ Fan, B Varia, Q Han
Microelectronics Reliability 50 (4), 536-546, 2010
An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling
V Vasudevan, X Fan
2008 58th Electronic components and technology conference, 139-145, 2008
Moisture Sensitivity of Plastic Packages of IC Devices
XJFE Suhir
Springer, 2010
Moisture Sensitivity of Plastic Packages of IC Devices
XJFE Suhir
Springer, 2010
Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loading
XJ Fan, HB Wang, TB Lim
IEEE Transactions on Components and Packaging Technologies 24 (1), 84-91, 2001
Recent advances in 2D/nanostructured metal sulfide-based gas sensors: mechanisms, applications, and perspectives
H Tang, LN Sacco, S Vollebregt, H Ye, X Fan, G Zhang
Journal of Materials Chemistry A 8 (47), 24943-24976, 2020
Interfacial delamination mechanisms during soldering reflow with moisture preconditioning
X Fan, GQ Zhang, WD Van Driel, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008
Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction
H Tang, Y Li, R Sokolovskij, L Sacco, H Zheng, H Ye, H Yu, X Fan, H Tian, ...
ACS applied materials & interfaces 11 (43), 40850-40859, 2019
PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers
B Sun, X Fan, C Qian, G Zhang
IEEE Transactions on Industrial Electronics 63 (11), 6726-6735, 2016
Effect of finite element modeling techniques on solder joint fatigue life prediction of flip-chip BGA packages
X Fan, M Pei, PK Bhatti
56th Electronic Components and Technology Conference 2006, 9 pp., 2006
Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
MD Placette, X Fan, JH Zhao, D Edwards
Microelectronics Reliability 52 (7), 1401-1408, 2012
Mechanics of moisture for polymers: fundamental concepts and model study
X Fan
EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008
Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages
X Fan, G Rasier, VS Vasudevan
Proceedings Electronic Components and Technology, 2005. ECTC'05., 901-906, 2005
A micromechanics-based vapor pressure model in electronic packages
XJ Fan, J Zhou, GQ Zhang, LJ Ernst
Direct concentration approach of moisture diffusion and whole-field vapor pressure modeling for reflow process—part I: theory and numerical implementation
B Xie, XJ Fan, XQ Shi, H Ding
Degradation modeling of mid-power white-light LEDs by using Wiener process
J Huang, DS Golubović, S Koh, D Yang, X Li, X Fan, GQ Zhang
Optics express 23 (15), A966-A978, 2015
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