| Power integrity modeling and design for semiconductors and systems M Swaminathan, E Engin Pearson Education, 2007 | 475 | 2007 |
| Power distribution networks for system-on-package: Status and challenges M Swaminathan, J Kim, I Novak, JP Libous IEEE Transactions on Advanced Packaging 27 (2), 286-300, 2004 | 334 | 2004 |
| Introduction to System on Package (SOP). R Tummala, M Swaminathan McGraw-Hill Professional Publishing, 2007 | 225 | 2007 |
| Impact of power-supply noise on timing in high-frequency microprocessors M Saint-Laurent, M Swaminathan IEEE Transactions on Advanced Packaging 27 (1), 135-144, 2004 | 210 | 2004 |
| Method for fabricating three-dimensional all organic interconnect structures GE White, M Swaminathan, V Sundaram, S Dalmia US Patent 7,805,834, 2010 | 200 | 2010 |
| Modeling and transient simulation of planes in electronic packages N Na, J Choi, S Chun, M Swaminathan, J Srinivasan IEEE Transactions on Advanced Packaging 23 (3), 340-352, 2000 | 194 | 2000 |
| The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ... IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004 | 186 | 2004 |
| Modeling of irregular shaped power distribution planes using transmission matrix method JH Kim, M Swaminathan IEEE Transactions on advanced packaging 24 (3), 334-346, 2001 | 186 | 2001 |
| A novel integrated decoupling capacitor for MCM-L technology P Chahal, RR Tummala, MG Allen, M Swaminathan IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 161 | 1998 |
| Designing and modeling for power integrity M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie IEEE Transactions on Electromagnetic Compatibility 52 (2), 288-310, 2010 | 160 | 2010 |
| Modeling of simultaneous switching noise in high speed systems S Chun, M Swaminathan, LD Smith, J Srinivasan, Z Jin, MK Iyer IEEE Transactions on Advanced Packaging 24 (2), 132-142, 2001 | 152 | 2001 |
| Electrical modeling of through silicon and package vias T Bandyopadhyay, R Chatterjee, D Chung, M Swaminathan, R Tummala 2009 IEEE International Conference on 3D System Integration, 1-8, 2009 | 147 | 2009 |
| High density memory structure MF McAllister, JA McDonald, GJ Robbins, M Swaminathan, GM Wilkins US Patent 5,523,619, 1996 | 141 | 1996 |
| Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions KJ Han, M Swaminathan, T Bandyopadhyay IEEE Transactions on Advanced Packaging 33 (4), 804-817, 2010 | 127 | 2010 |
| Rigorous electrical modeling of through silicon vias (TSVs) with MOS capacitance effects T Bandyopadhyay, KJ Han, D Chung, R Chatterjee, M Swaminathan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (6 …, 2011 | 119 | 2011 |
| Computation of cutoff wavenumbers of TE and TM modes in waveguides of arbitrary cross sections using a surface integral formulation M Swaminathan, E Arvas, TK Sarkar, AR Djordjevic IEEE transactions on microwave theory and techniques 38 (2), 154-159, 1990 | 119 | 1990 |
| A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications J Choi, V Govind, M Swaminathan Proceedings. 2004 IEEE Radio and Wireless Conference (IEEE Cat. No. 04TH8746 …, 2004 | 118 | 2004 |
| High-dimensional global optimization method for high-frequency electronic design HM Torun, M Swaminathan IEEE Transactions on Microwave Theory and Techniques 67 (6), 2128-2142, 2019 | 116 | 2019 |
| Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and Joule heating effects J Xie, M Swaminathan IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 115 | 2011 |
| A global Bayesian optimization algorithm and its application to integrated system design HM Torun, M Swaminathan, AK Davis, MLF Bellaredj IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (4), 792-802, 2018 | 114 | 2018 |
