Philippe M. Vereecken
Philippe M. Vereecken
Distinguished Member of Technical Staff/Professor imec/KULeuven
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TitleCited byYear
Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface
MJ Williamson, RM Tromp, PM Vereecken, R Hull, FM Ross
Nature materials 2 (8), 532-536, 2003
The chemistry of additives in damascene copper plating
PM Vereecken, RA Binstead, H Deligianni, PC Andricacos
IBM Journal of Research and Development 49 (1), 3-18, 2005
Quantifying electrochemical nucleation and growth of nanoscale clusters using real-time kinetic data
A Radisic, PM Vereecken, JB Hannon, PC Searson, FM Ross
Nano Letters 6 (2), 238-242, 2006
Liner materials for direct electrodeposition of Cu
MW Lane, CE Murray, FR McFeely, PM Vereecken, R Rosenberg
Applied physics letters 83 (12), 2330-2332, 2003
Chemical vapour deposition of zeolitic imidazolate framework thin films
I Stassen, M Styles, G Grenci, H Van Gorp, W Vanderlinden, S De Feyter, ...
Nature materials 15 (3), 304, 2016
Electrochemical Deposition of Copper on n‐Si/TiN
G Oskam, PM Vereecken, PC Searson
Journal of The Electrochemical Society 146 (4), 1436-1441, 1999
Plasma-enhanced chemical vapour deposition growth of Si nanowires with low melting point metal catalysts: an effective alternative to Au-mediated growth
F Iacopi, PM Vereecken, M Schaekers, M Caymax, N Moelans, ...
Nanotechnology 18 (50), 505307, 2007
Particle codeposition in nanocomposite films
PM Vereecken, I Shao, PC Searson
Journal of the Electrochemical Society 147 (7), 2572-2575, 2000
The morphology and nucleation kinetics of copper islands during electrodeposition
A Radisic, PM Vereecken, PC Searson, FM Ross
Surface science 600 (9), 1817-1826, 2006
Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects
S Masahito, Y Kashiwagi, Y Li, K Arstila, O Richard, DJ Cott, M Heyns, ...
Nanotechnology 22 (8), 085302, 2011
Selective capping of copper wiring
PC Andricacos, ST Chen, JM Cotte, H Deligianni, M Krishnan, WT Tseng, ...
US Patent 7,008,871, 2006
Selective capping of copper wiring
P Andricacos, ST Chen, J Cotte, H Deligianni, M Krishnan, WT Tseng, ...
US Patent App. 10/611,931, 2005
Synthesis and Characterization of Particle-reinforced Ni/Al2O3 Nanocomposites
I Shao, PM Vereecken, CL Chien, PC Searson, RC Cammarata
Journal of materials research 17 (6), 1412-1418, 2002
Solvent-free synthesis of supported ZIF-8 films and patterns through transformation of deposited zinc oxide precursors
I Stassen, N Campagnol, J Fransaer, P Vereecken, D De Vos, R Ameloot
CrystEngComm 15 (45), 9308-9311, 2013
Kinetics of particle codeposition of nanocomposites
I Shao, PM Vereecken, RC Cammarata, PC Searson
Journal of the Electrochemical Society 149 (11), C610-C614, 2002
Electrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copper
JG Long, PC Searson, PM Vereecken
Journal of The Electrochemical Society 153 (4), C258-C264, 2006
Copper plating for 3D interconnects
A Radisic, O Lühn, J Vaes, S Armini, Z El-Mekki, D Radisic, W Ruythooren, ...
ECS Transactions 25 (38), 119-125, 2010
Magnetotransport properties of bismuth films on p-GaAs
PM Vereecken, L Sun, PC Searson, M Tanase, DH Reich, CL Chien
Journal of Applied Physics 88 (11), 6529-6535, 2000
Integration and electrical characterization of carbon nanotube via interconnects
Y Li, DJ Cott, S Mertens, N Peys, M Heyns, S De Gendt, G Groeseneken, ...
Microelectronic Engineering 88 (5), 837-843, 2011
Effect of additives on shape evolution during electrodeposition II. Parameter estimation from roughness evolution experiments
E Rusli, F Xue, TO Drews, PM Vereecken, P Andricacos, H Deligianni, ...
Journal of The Electrochemical Society 154 (11), D584-D597, 2007
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