| Numerical simulation of silicon wafer warpage due to thin film residual stresses AH Abdelnaby, GP Potirniche, F Barlow, A Elshabini, S Groothuis, ... 2013 IEEE workshop on microelectronics and electron devices (WMED), 9-12, 2013 | 23 | 2013 |
| Numerical simulation of heat generation during the back grinding process of silicon wafers AH Abdelnaby, GP Potirniche, A Elshabini, F Barlow, SK Groothuis, ... 2012 IEEE Workshop on Microelectronics and Electron Devices, 1-4, 2012 | 8 | 2012 |
| Engineered carrier wafers AH Abdelnaby, S Varghese US Patent 9,412,706, 2016 | 3 | 2016 |
| Finite element modeling of a back grinding process for Through Silicon Vias AH Abdelnaby, GP Potirniche, F Barlow, A Elshabini, R Parker 2011 IEEE Workshop on Microelectronics and Electron Devices, 1-4, 2011 | 3 | 2011 |
| Numerical simulations of a back grinding process for silicon wafers AH Abdelnaby, GP Potirniche, F Barlow, B Poulsen, A Elshabini, R Parker, ... Advances and Applications in Electroceramics 226, 1-11, 2011 | 2 | 2011 |
| A comparison of back grinding processes for bare silicon and through-silicon via wafers using numerical simulations AH Abdelnaby, GP Potirniche, A Elshabini, F Barlow, R Parker Journal of microelectronics and electronic packaging 8 (4), 146-153, 2011 | 1 | 2011 |
| Controlled Formation of Square Crack in Thinned 3DI Silicon Wafers A Abdelnaby, R Parker, P Chennapragada, S Vadhavkar, W Huang, ... 2015 IEEE Workshop on Microelectronics and Electron Devices (WMED), 1-4, 2015 | | 2015 |
| INTEGRATED TOOLS AND SYSTEMS TO IMPROVE 3DI MANUFACTURABILITY S Varghese, AH Abdelnaby, JS Hacker | | 2014 |
| Numerical Simulations for the Characterization of the Back Grinding Process for Silicon Wafers A Abdelnaby University of Idaho, 2013 | | 2013 |
| IEEE WMED 2021 Organizing Committee A Abdelnaby, E Graugnard, K Cantley, L Li, R Rannow, R Wolff, S Surthi, ... | | |
| Welcome to the IEEE WMED 2019 A Abdelnaby | | |
| IEEE WMED 2018 Organizing Committee R Wolff, V Avula, R Bhonsle, T Liu, D Panda, K Muthukrishnan, A Saxler, ... | | |
| IEEE WMED 2017 Organizing Committee P Sharma, R Wolff, K Muthukrishnan, T Liu, D Panda, VK Butte, N Lomeli, ... | | |
| IEEE WMED 2016 Organizing Committee Y Ma, P Sharma, K Muthukrishnan, T Liu, H Naidu, S Qin, D Panda, ... | | |
